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Infineon NOR Flash Memory 512 MB SPI Interface 24-Pin BGA Package S25HS512TFABHI010
Specifications
| Country of Origin | India |
|---|---|
| Brand | Infineon |
| Height | 950μm |
| Length | 8mm |
| Cell Type | NOR |
| Model | S25HS512TFABHI010 |
| Width | 6mm |
| Mount Type | Surface |
| Series | Semper |
| Maximum Operating Temperature | 85°C |
| Certificates | ISO 26262 ASIL B Compliant |
| Package Type | BGA |
| Minimum Operating Temperature | -40°C |
| Memory size | 512MB |
| Interface Type | SPI |
| Pin Count | 24 |
| Automotive Standard | AEC-Q100 |
| Maximum Supply Voltage | 1.8V |
| Minimum Supply Voltage | 2V |
| Maximum Clock Frequency | 166MHz |
| Organisation | 64M x 8 Bit |
| Number of Bits per Word | 8 |
| Maximum Random Access Time | 8ns |
| Timing Type | Asynchronous |
| EnduraFlex™ Architecture | Partition memory to provide up to 25-years data retention and 1+ million program/erase cycles endurance |
Key Features
- Offers 512 MB memory size suitable for advanced data storage needs.
- Supports SPI interface enabling fast data communication.
- Features 24-pin BGA package optimized for surface mounting.
- Maximum clock frequency of 166 MHz for high-speed operation.
- Wide operating temperature range from -40°C to 85°C ensuring reliability.
- Implements NOR cell type for non-volatile memory storage.
- Automotive AEC-Q100 standard compliant for robust automotive usage.
- EnduraFlex™ Architecture allows up to 25 years data retention and over 1 million program/erase cycles.
Product Description
Infineon S25HS512TFABHI010 is a high-performance NOR Flash Memory offering 512 MB capacity with SPI interface in a compact 24-pin BGA package. It is designed for industrial and automotive systems requiring reliable and secure non-volatile memory.
This Flash Memory operates asynchronously with a maximum clock frequency of 166 MHz, supporting efficient data transfer and execution. The device utilizes NOR cell technology, known for fast random access times and endurance.
The memory features EnduraFlex™ Architecture, allowing partitioned memory with exceptional endurance of over 1 million program/erase cycles and data retention exceeding 25 years. These attributes make it ideal for safety-critical automotive applications such as instrument clusters, advanced driver assistance systems (ADAS), and networking communications.
Designed to meet automotive standards, it complies with AEC-Q100 and is ISO 26262 ASIL B certified, supporting compliance with rigorous functional safety requirements. The device supports single error correction and double error detection (SECDED) to enhance data integrity.
The package dimensions are compact - 8mm length, 6mm width, and height of 950 μm - suitable for surface mounting on printed circuit boards (PCBs). Operating temperature ranges from -40°C to 85°C provide reliability under harsh environmental conditions.
512 MB NOR Flash memory with SPI interface. 24-pin BGA surface-mount package. Max clock frequency of 166 MHz for fast data access. EnduraFlex™ architecture providing long data retention and high program/erase endurance. Compliance with AEC-Q100 automotive standard.
ISO 26262 ASIL B certification for functional safety. Data integrity features including SECDED and Interface CRC. Operating temperature from -40°C to 85°C. Compact dimensions: 8 mm x 6 mm x 950 μm. Applicable for automotive clusters, ADAS, and networking.
This Infineon Flash Memory is a reliable choice for automotive and industrial manufacturers seeking high-performance, durable, and certified memory solutions. Browse our Electronics & Electricals catalog for related semiconductor and memory products to support your design and manufacturing needs.
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Frequently Asked Questions
The Infineon NOR Flash Memory offers a memory size of 512 MB, suitable for advanced data storage needs.
It has a maximum clock frequency of 166 MHz, enabling high-speed data access.
This model supports an SPI interface, which facilitates fast data communication.
The package dimensions are 8 mm in length, 6 mm in width, and 950 μm in height, optimized for surface mounting.
It operates within a temperature range from -40°C to 85°C, ensuring reliability under harsh conditions.
This model complies with the AEC-Q100 automotive standard and is ISO 26262 ASIL B certified for functional safety.
The EnduraFlex™ Architecture allows for partitioned memory with up to 25 years of data retention and over 1 million program/erase cycles, enhancing durability.
This memory utilizes NOR cell technology, known for its fast random access times and endurance.
The maximum random access time is 8 ns, supporting efficient data retrieval.
The memory operates with a supply voltage ranging from 2V to 1.8V.
It is designed for automotive and industrial applications, including instrument clusters and advanced driver assistance systems (ADAS).
It includes features such as single error correction and double error detection (SECDED) to improve data integrity.
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