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Loctite Lead Free Solder Paste 500 g Tub 1817229
Specifications
| Country of Origin | India |
|---|---|
| Brand | Loctite |
| Model | 1817229 |
| Package Type | Tub |
| Package Size | 500 g |
| RS 832-9750 | HF 212 solder paste 97SC DAP |
| RS 832-9769 | HF 212 solder paste 90iSC DAP |
| RS 832-9762 | HF 212 solder paste 90iSC AGS |
| RS 832-9766 | HF 212 solder paste 97SC AGS |
| RS 832-9775 | HF 212 solder paste SAC0307 AGS |
| Henkel Loctite HF212 90iSC AGS Lead Free Solder Paste, 500g JarBrand | Henkel |
Key Features
- Halogen-free solder paste suitable for high-value PCB applications.
- Offers a wide reflow process window ensuring consistent soldering quality.
- Compatible with industry standard SAC and low silver alloys SAC.
- Supports high-speed printing up to 150 mm/s for efficient production.
- Solderable on challenging surface finishes such as CuNiZn and Copper OSP.
- Leaves colorless residues for easy post-reflow inspection.
- Ideal for medium to large board assemblies with excellent wetting properties.
- Designed for printing, pin-in-paste, and enclosed head print capability.
Product Description
Loctite 1817229 Lead Free Solder Paste is a 500 g tub of halogen-free, no-clean, Pb-free solder paste designed to withstand the thermal demands of larger PCB assemblies. It provides high reliability and a broad reflow process window, ensuring stable and superior solder joints for high-value printed circuit board applications.
The solder paste is suitable for use with industry-standard SAC alloys, as well as high reliability SAC and low silver SAC alloys, supporting diverse assembly requirements. It supports high speed printing processes up to 150 mm/s, increasing manufacturing throughput without compromising quality.
Its formulation allows soldering on difficult surface finishes, including CuNiZn and Copper OSP, expanding its suitability across various PCB surface treatments. The paste leaves colorless residues post-reflow, which facilitates straightforward inspection without additional cleaning processes.
Specifically designed for printing, pin-in-paste, and enclosed head print capabilities, Loctite HF 212 solder paste enables excellent wetting on a broad spectrum of metallizations, making it ideal for medium to large board assemblies in electronics manufacturing.
Halogen-free solder paste suitable for high-value PCB applications. Wide reflow process window ensures reliable soldering quality. Compatible with standard SAC and low silver SAC alloys. Supports high speed printing up to 150 mm/s.
Solderable on difficult surface finishes like CuNiZn and Copper OSP. Colorless residues enable easy post-reflow inspection. Designed for printing, pin-in-paste, and enclosed head print techniques. Excellent wetting for a wide range of metallizations.
Loctite Solder Pastes are widely used in the electronics manufacturing industry for their reliability and ease of use. This product is especially applicable in industrial, commercial, and laboratory environments focused on PCB assembly and repair.
Explore more soldering solutions from Loctite and other brands in the EnvMart catalog for comprehensive electronics manufacturing and repair needs.
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Frequently Asked Questions
The Loctite Lead Free Solder Paste is available in a 500 g tub.
This model is a halogen-free, no-clean, lead-free solder paste designed for high-value PCB applications.
It supports high-speed printing processes up to 150 mm/s, enhancing manufacturing throughput.
It is suitable for soldering on challenging surface finishes such as CuNiZn and Copper OSP.
This solder paste is compatible with industry-standard SAC alloys, as well as high reliability SAC and low silver SAC alloys.
It is ideal for medium to large board assemblies in electronics manufacturing, particularly for PCB assembly and repair.
The paste leaves colorless residues post-reflow, which facilitates easy inspection without additional cleaning processes.
It is designed for printing, pin-in-paste, and enclosed head print techniques.
The country of origin for this solder paste is India.
The model number for this solder paste is 1817229.
It offers excellent wetting properties across a broad spectrum of metallizations, ensuring reliable solder joints.
Yes, it is specifically designed for high-value PCB applications, providing high reliability and a broad reflow process window.
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