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| Country of Origin | India |
|---|---|
| Size | 3.2mm x 1.6mm x 1.2mm |
| Brand | OSA Opto |
| Model | OIS-150-1300p-X-T |
| Technology | GaP, AlInGaP, GaAlAs and InGaN |
| Packaging | Tape |
| Mount Type | Surface |
| Series | OIS-150 |
| Number Of Leds | 1 |
| Package Type | 1206 |
| Number of Pins | 2 |
| Lens Shape | Square |
| Peak Wavelength | 1300nm |
| Radiant Flux | 1.5mW |
| LED Material | InGaN, GaP, GaAlAs, AlInGaP |
| Radiant Intensity | 0.5mW/sr |
| view angle | 140° |
| soldering pads | gold plated |
| circuit substrate | glass laminated epoxy |
| Lead free solderable, soldering pads | gold plated |
| taping | face-up(TU) or face-down(TD) possible |
OSA Opto presents the OIS-150-1300p-X-T infrared LED featuring a peak wavelength of 1300 nm, delivering a radiant flux of 1.5 mW with a radiant intensity of 0.5 mW/sr. Packaged in a standard 1206 surface mount device, this IR LED is designed for efficient emission and integration into SMT assemblies.
Measuring 3.2 mm by 1.6 mm by 1.2 mm, the LED utilizes a square lens shape providing a broad 140 degree viewing angle, suitable for a variety of electronic and optoelectronic equipment. Gold plated soldering pads ensure excellent solderability and reliability in automated mounting processes.
Constructed using advanced semiconductor materials such as InGaN, GaP, GaAlAs, and AlInGaP, the LED achieves high brightness and consistency. The circuit substrate is composed of glass laminated epoxy, enhancing thermal and mechanical stability during operation.
Additional product features include lead-free solderable pads and flexible tape packaging with face-up or face-down taping options to meet diverse manufacturing requirements.
This Infrared LED is well suited for applications in industrial electronics, power connectors, displays, optoelectronics, and other high-reliability LED systems. It complies with RoHS standards and offers no automotive certifications.
Operating at 1300 nm peak wavelength for infrared emission. Radiant flux of 1.5 mW with radiant intensity 0.5 mW/sr. 1206 surface mount package sized 3.2 × 1.6 × 1.2 mm. Gold plated soldering pads compatible with SMT assembly.
Wide viewing angle of 140 degrees with square lens shape. Advanced materials including InGaN, GaP, GaAlAs, AlInGaP. Glass laminated epoxy circuit substrate for durability. Lead-free soldering pads and flexible taping options.
Ideal for industrial electronics and optoelectronic devices. Explore the extensive range of IR LEDs and electronic components at EnvMart for innovative and reliable solutions.
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