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Loctite Halide-Free No Clean Pin Testable Solder Paste 540 g Container Loctite MP 218

Category Solder Paste Brand Loctite Condition New

Specifications

Country of Origin Hungary
Brand Loctite
Model Loctite MP 218
Package Type Container
Package Size 540 g
Standards/Approvals ANSI/J-STD-004, IPC/J-STD-006 & EN29453

Key Features

  • Halide-free formulation with no-clean residues for easy post-reflow inspection.
  • Pin testable residues allowing easy in-circuit testing procedures.
  • High tack force to resist component movement during high-speed placement.
  • Compatible with a wide range of surface finishes including HASL, Ni/Au, Immersion Sn, Immersion Ag and OSP copper.
  • Suitable for fine pitch, high-speed printing up to 150 mm/s (6 inches per second).
  • Works effectively in both air and nitrogen reflow profiles.
  • Soft, non-stick residues reduce soldering defects and cleaning requirements.
  • Broad process window enables flexible manufacturing conditions.

Product Description

Loctite Loctite MP 218 solder paste in a 540 g container offers a halide-free, no-clean formula that is pin testable and provides excellent humidity resistance along with a broad process window for both reflow and printing applications.

This solder paste demonstrates a high tack force, which secures components firmly in place during high-speed placement and supports long printer abandon times. Its excellent solderability is maintained across a variety of reflow profiles in both air and nitrogen atmospheres, ensuring reliable results in diverse manufacturing environments.

The paste is compatible with numerous surface finishes, including HASL, Ni/Au, Immersion Sn, Immersion Ag, and OSP copper, making it versatile for many printed circuit board assembly processes. Its colorless residues facilitate easy post-reflow inspection, and its soft, non-stick nature allows straightforward pin testing and in-circuit testing without contamination.

Ideal for fine pitch soldering and high-speed printing up to 150 mm/s, this solder paste supports modern electronics manufacturing demands. It is developed to meet industry standards including ANSI/J-STD-004, IPC/J-STD-006, and EN29453, certifying its quality and performance consistency.

Halide-free and no-clean formulation ensures reliable solder joints with minimal residue. Pin testable residues allow for efficient in-circuit testing with no residue contamination. High tack strength prevents component displacement during rapid placement.

Compatible with various surface finishes, enhancing broad applicability. Soft and non-stick residues minimize defects and ease cleaning operations. Supports fine pitch components and speeds up to 150 mm/s in printing. Operates effectively in air and nitrogen reflow profiles.

Conforms to relevant international standards for soldering materials.

This product is widely used in industrial electronics manufacturing, laboratory prototyping, and commercial assembly applications where precision soldering is critical. Its unique properties ensure durability, quality solder joints, and ease of testing, making it a preferred choice for advanced soldering needs.

Explore our comprehensive range of Solder Pastes and related materials in the Industrial Tools & Equipment category to find solutions tailored to your manufacturing and assembly requirements.

Loctite Halide-Free No Clean Pin Testable Solder Paste 540 g Container Loctite MP 218
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