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| Country of Origin | India |
|---|---|
| Brand | Winbond |
| Height | 1.05mm |
| Length | 12.1mm |
| Cell Type | SLC NAND |
| Model | W29N08GZSIBA |
| Width | 12mm |
| Mount Type | Surface |
| Series | W29N08GZ |
| Maximum Operating Temperature | 85°C |
| Package Type | TSOP |
| Minimum Operating Temperature | -40°C |
| Memory size | 8GB |
| Interface Type | Parallel |
| Pin Count | 48 |
| Maximum Supply Voltage | 1.95V |
| Minimum Supply Voltage | 1.7V |
| Maximum Clock Frequency | 40MHz |
| Organisation | 1024 x 8 bit |
| Number of Bits per Word | 8 |
| Maximum Random Access Time | 25μs |
| Number of Words | 1024K |
| Bus Width | x8 |
| Random read | 25us |
| Page program time | 250us(typ.) |
| Block erase time | 2ms(typ.) |
Winbond W29N08GZSIBA is an 8 Gb Single-Level Cell (SLC) NAND Flash Memory designed with a parallel interface and housed in a 48-pin Thin Small Outline Package (TSOP). This surface-mount device is optimized for industrial and consumer electronics applications requiring reliable and high-speed memory storage solutions.
The flash memory features a data organization of 1024K x 8 bits and operates up to a maximum clock frequency of 40 MHz, delivering swift access and programming speeds. It supports a bus width of x8 and offers random read access times as low as 25 microseconds. Typical page program and block erase times are 250 microseconds and 2 milliseconds respectively, ensuring efficiency in memory write and erase cycles.
Designed for demanding environmental conditions, this memory chip functions reliably across wide temperature ranges from -40°C to 85°C. It operates within a supply voltage range of 1.7V to 1.95V, suitable for low-power embedded systems. The compact package dimensions of 12.1 mm length, 12 mm width, and 1.05 mm height allow integration into space-constrained circuit designs.
The SLC architecture provides enhanced endurance and reliability compared to multi-level cell technologies, making it ideal for applications requiring frequent write and erase cycles. Additionally, the chip supports an OTP (One Time Programmable) memory area for secure data storage purposes.
This Flash Memory is applicable for a broad range of industrial, consumer electronics, and embedded system uses, including automotive electronics (though it does not meet automotive standards), communication devices, and storage expansion modules.
Memory capacity of 8GB with parallel interface type. Supplied in 48-pin TSOP package for surface mounting. Supports maximum clock frequency of 40 MHz for fast operation. Operates in a temperature range from -40°C to 85°C.
Utilizes single-level cell (SLC) technology for enhanced endurance and reliability. Minimum supply voltage of 1.7V and maximum supply voltage of 1.95V. Compact dimensions: 12.1mm x 12mm x 1.05mm. Fast random read access time of 25 microseconds.
Page program time typically 250 microseconds and block erase time 2 milliseconds. Includes support for OTP memory area for secure data storage. Explore our extensive selection of semiconductor components at EnvMart for your memory and embedded system needs.
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