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Samtec CLP Series Vertical Surface PCB Socket, 12 Contacts, Dual Row, 1.27 mm Pitch, Solder, CLP-106-02-G-D-P-TR

Category PCB Socket Brand Samtec Condition New

Specifications

Country of Origin India
Voltage 395V
Brand Samtec
Orientation Vertical
Current 3.4A
Model CLP-106-02-G-D-P-TR
Packaging Tape and Reel
Mount Type Surface
Housing Material Liquid Crystal Polymer
Contact Material Phosphor Bronze
Series CLP
Termination Type Solder
Maximum Operating Temperature 125°C
Sub Type Dual Wipe Socket
Minimum Operating Temperature -55°C
Number of Rows 2
Pitch 1.27mm
Contact Plating Gold
Number of Contacts 12
Connector System Board-to-Board

Key Features

  • Features 12 contact positions for versatile PCB designs.
  • Dual row socket with 1.27 mm pitch, ideal for compact circuit layouts.
  • Surface mount, vertical orientation for efficient board stacking.
  • Reliable phosphor bronze contacts with gold plating ensure secure connections.
  • Rated for 3.4 A current and 395 V voltage applications.
  • Constructed with robust liquid crystal polymer for durability.
  • Wide operating temperature range from -55°C to 125°C.
  • Tape and reel packaging for automated assembly processes.

Product Description

The Samtec CLP-106-02-G-D-P-TR is a high-quality vertical surface mount PCB socket designed for compact and reliable board-to-board connections in advanced electronic assemblies.

Equipped with 12 contact positions in a dual row arrangement and a 1.27 mm pitch, this connector is ideal for space-constrained applications requiring multiple mating points. Surface mount compatibility and vertical orientation provide efficient use of PCB real estate, supporting modern stacking and modularization practices in device manufacturing.

The socket comprises durable liquid crystal polymer housing, ensuring mechanical resilience and thermal stability throughout its wide operating temperature range of -55°C to 125°C. Contact terminals are fabricated from phosphor bronze and finished with gold plating, delivering excellent corrosion resistance and reliable electrical conductivity. Rated for 3.4 A and 395 V, the CLP-106-02-G-D-P-TR meets the rigorous demands of industrial, instrumentation, automation, telecom, and consumer electronics sectors.

Features 12 contact positions for versatile PCB designs. Dual row socket with 1.27 mm pitch, ideal for compact circuit layouts. Surface mount, vertical orientation for efficient board stacking. Reliable phosphor bronze contacts with gold plating ensure secure connections.

Rated for 3.4 A current and 395 V voltage applications. Constructed with robust liquid crystal polymer for durability. Wide operating temperature range from -55°C to 125°C. Tape and reel packaging for automated assembly processes.

This PCB socket is especially well-suited for automated production lines, prototyping, and systems demanding high density interconnections. Common use cases include industrial controllers, measurement instrumentation, embedded systems, and high-performance communication hardware. Its dual wipe contact type enhances mating cycle durability, making it an optimal choice for professional assembly units.

Choose the Samtec CLP Series for exceptional reliability in PCB sockets. Explore more electronic connectors and solutions in the PCB Socket category at EnvMart.

Samtec CLP Series Vertical Surface PCB Socket, 12 Contacts, Dual Row, 1.27 mm Pitch, Solder, CLP-106-02-G-D-P-TR
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Frequently Asked Questions

The Samtec CLP-106-02-G-D-P-TR is rated for a current of 3.4 A.

This model has a voltage rating of 395 V.

The housing of this PCB socket is constructed from liquid crystal polymer.

It features 12 contact positions in a dual row arrangement.

The contact pitch for this model is 1.27 mm.

This unit operates within a temperature range of -55°C to 125°C.

The termination type for this model is solder.

This socket is designed for vertical orientation.

It utilizes a board-to-board connector system.

The contacts are made from phosphor bronze and are plated with gold.

This model is packaged in tape and reel format for automated assembly processes.

It is suitable for applications in industrial controllers, measurement instrumentation, embedded systems, and high-performance communication hardware.

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