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| Country of Origin | United States |
|---|---|
| Voltage | 200V |
| Brand | Amphenol Communications Solutions |
| Orientation | Straight |
| Current | 450mA |
| Model | 74221-101LF |
| Housing Material | Liquid Crystal Polymer |
| Contact Material | Copper Alloy |
| Series | Meg-Array |
| Termination Type | Solder |
| Maximum Operating Temperature | 85°C |
| Package Type | Surface Mount |
| Minimum Operating Temperature | -55°C |
| Number of Rows | 8 |
| Pitch | 1.27mm |
| Contact Plating | Gold |
| Number of Contacts | 400 |
| IC Socket Type | Prototyping Socket |
| Socket Mount Type | Surface |
| 6 PCB Stack heights | 4 mm to 14mm |
| 8 sizes | 81 to 528 positions Revolutionary, trusted BGA interconnect platform |
The Amphenol Communications Solutions 74221-101LF is a high-density, surface mount IC socket designed for advanced prototyping applications. This Meg-Array series IC socket incorporates a 400-way contact configuration, providing extensive connectivity for complex electronic circuit designs and high-performance PCBs.
With a compact 1.27 mm pitch across 8 rows, this socket is engineered for optimal space efficiency, offering 71 contacts per cm² density. The high-speed differential pair design supports signal speeds up to 10 Gb/s with minimal cross-talk, making it ideal for demanding high-frequency electronic systems. Users benefit from documented high-speed performance up to 28 Gb/s for stack heights of 4 mm and 6 mm, enabling versatile layout possibilities in industrial, telecommunications, and instrumentation applications.
Constructed with gold-plated copper alloy contacts and housed in liquid crystal polymer, the socket ensures excellent mechanical fidelity and long-term reliability. Gold plating maximizes conductivity, reduces oxidation, and provides enduring electrical contact. The housing material offers robust thermal resistance, supporting an operating temperature range from -55°C to +85°C.
Surface mount technology and solder termination simplify assembly in modern production environments, while the component’s natural surface tension enables self-alignment and leveling during installation. The patented BGA (Ball Grid Array) contact attachment preserves solder ball positioning, allowing for reliable connections and enhanced electrical performance.
Meg-Array series flexibility enables PCB stack heights from 4 mm to 14 mm, catering to varied mechanical and electrical requirements. Dual-point, long wipe contacts increase durability and maintain stable connections, even in environments subject to vibration or thermal cycling. This socket is suitable for prototyping in computer hardware, communication equipment, industrial automation controllers, and laboratory electronic projects requiring dense, reliable interconnects.
The Amphenol 74221-101LF complies with stringent quality standards, documented reliability options, and Telcordia GR-1217-CORE and NPS-25298-2 compatibility. It is a lead-free component, supporting environmentally responsible practices in electronics manufacturing.
Applications include high-speed test boards, advanced prototyping environments, telecommunications, industrial controls, and other sectors demanding dense connectivity and robust mechanical properties.
Browse more Meg-Array series solutions from Amphenol Communications Solutions and discover a full range of PCB Sockets and IC connectors on EnvMart for comprehensive electronic and industrial needs.
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