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| Country of Origin | India |
|---|---|
| Brand | Winbond |
| Height | 600μm |
| Length | 10.6mm |
| Model | W631GG8NB12I |
| Width | 8.1mm |
| Mount Type | Surface |
| Series | W631GG6NB |
| Maximum Operating Temperature | 95°C |
| Package Type | VFBGA |
| Minimum Operating Temperature | -40°C |
| Memory size | 1GB |
| Standards/Approvals | RoHS |
| Pin Count | 78 |
| Maximum Supply Voltage | 1.57V |
| Minimum Supply Voltage | 1.43V |
| Organisation | 128M x 8 |
| Number of Bits per Word | 8 |
| Maximum Random Access Time | 20ns |
| Number of Words | 128M |
Winbond W631GG8NB12I is a 1 GB SDRAM module packaged in a 78-pin VFBGA surface mount format, designed for high-speed memory applications. It features a 16-bit data bus width and 128M x 8 memory organization which supports 8 banks of 8 bits each, facilitating efficient data processing.
The device achieves a maximum random access time of 20 nanoseconds, optimizing its use in systems requiring rapid memory access. Operating supply voltage ranges from 1.43 V to 1.57 V, with an extended operating temperature range between -40°C and 95°C, making it suitable for industrial and commercial electronics applications.
The compact surface mount VFBGA package measures 10.6 mm in length, 8.1 mm in width, and stands 600 micrometers tall, enabling space-saving integration on PCBs. The product complies with RoHS environmental standards, ensuring that it meets regulatory requirements for hazardous substance restrictions.
This Winbond SDRAM module is ideal for use in electronic components manufacturing, semiconductors, embedded systems, and computing applications that require reliable and high-performance memory chips. Its surface mount package supports automated assembly processes for improved production efficiency.
This memory device offers a 16 bit data bus width for efficient data transfer. The SDRAM operates with a maximum random access time of 20 nanoseconds. It supports a supply voltage range between 1.43 V and 1.57 V. Designed for operating temperature range from -40°C to 95°C, suitable for various environments.
The compact VFBGA package measures 10.6 mm length, 8.1 mm width, and 600 µm height. Complies with RoHS standards ensuring environmental safety. The memory organization is 128 million words by 8 bits, structured in 8 banks.
Surface mount technology enables efficient PCB assembly and miniaturization. Explore more Winbond semiconductor products and high-quality Memory Chips suitable for diverse electronics manufacturing and repair needs at EnvMart.
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