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CIF Copper Clad Board Epoxy Base with 35μm Copper Thickness, 0.8mm Thickness, 300mm Length ADB20

Category Copper Clad Boards Brand CIF Condition New

Specifications

Country of Origin France
Brand CIF
Length 300mm
Model ADB20
Board Material Epoxy Base
Standards/Approvals RoHS
Number of Sides 1
Board Thickness 0.8mm
FR Material Grade FR4
Copper Thickness 35μm

Key Features

  • Constructed with FR4 grade epoxy base for durability and reliability.
  • Features a single side copper layer with 35 micrometer thickness for efficient conductivity.
  • Board thickness is 0.8 mm providing a sturdy and stable platform.
  • RoHS compliant, ensuring environmentally safe manufacturing practices.
  • Produced in France, guaranteeing high manufacturing standards.
  • Packaged individually in protective plastic bags to maintain board quality before use.
  • Board is untreated and not photoresist, designed for customized engraving or touch-up applications.

Product Description

The CIF ADB20 Copper Clad Board Epoxy Base combines high-quality materials with precise manufacturing standards, presenting a reliable prototyping solution for electronic engineers and technicians.

Featuring a FR4 epoxy base material known for excellent electrical insulation and mechanical properties, the board incorporates a single side copper layer of 35 μm thickness, ensuring optimal electrical conductivity and solderability for circuit development.

With a board thickness of 0.8 mm and a length of 300 mm, this copper clad board is designed to support accurate prototyping and custom circuit designs in laboratory, manufacturing, and electronic assembly environments.

Manufactured in France under RoHS compliant processes, the product maintains environmental consciousness without compromising on performance standards.

The board is untreated and does not come with photoresist, allowing flexibility for users to engrave or apply touch-up pens as needed for customized circuit fabrication. Each board is packaged individually in protective plastic bags to preserve the copper surface integrity during transportation and storage.

Constructed with FR4 grade epoxy base for durability and reliability. Features a single side copper layer with 35 micrometer thickness for efficient conductivity. Board thickness is 0.8 mm providing a sturdy and stable platform.

Length of 300 mm suitable for various electronic prototyping applications. RoHS compliant, ensuring environmentally safe manufacturing practices. Produced in France, guaranteeing high manufacturing standards. Packaged individually in protective plastic bags to maintain board quality before use.

Board is untreated and not photoresist, designed for customized engraving or touch-up applications.

This copper clad board is ideal for use in electronics manufacturing, laboratory prototyping, educational projects, and custom PCB fabrication setups, providing a versatile and dependable base layer material.

Explore the extensive range of prototyping materials available on EnvMart to enhance your electronic development projects with precision components and quality materials.

Explore more products in our Copper Clad Boards category.

CIF Copper Clad Board Epoxy Base with 35μm Copper Thickness, 0.8mm Thickness, 300mm Length ADB20
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Frequently Asked Questions

The CIF Copper Clad Board features a copper thickness of 35 micrometers.

This model has a board thickness of 0.8 mm, providing a sturdy and stable platform for various applications.

The length of this copper clad board is 300 mm, suitable for various electronic prototyping applications.

The board is constructed from an epoxy base material, specifically FR4 grade, known for its excellent electrical insulation and mechanical properties.

Yes, the CIF Copper Clad Board is RoHS compliant, ensuring environmentally safe manufacturing practices.

This copper clad board is ideal for electronics manufacturing, laboratory prototyping, educational projects, and custom PCB fabrication setups.

Each board is individually packaged in protective plastic bags to maintain the quality of the board before use.

The CIF Copper Clad Board is produced in France, ensuring high manufacturing standards.

No, the board is untreated and does not come with photoresist, allowing for customized engraving or touch-up applications.

This copper clad board features a single side copper layer, enhancing its conductivity and solderability.

Key features of the ADB20 model include a 35 μm copper thickness, 0.8 mm board thickness, and RoHS compliance, all constructed with an epoxy base.

The untreated surface allows users the flexibility to engrave or apply touch-up pens for customized circuit fabrication as needed.

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