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Bergquist CPU PAD Series Self-Adhesive Thermal Interface Pad, 0.13 mm Thick, 0.6 W/mK Thermal Conductivity, 35 CPU PAD 35X35

Category Thermal Pads Brand Bergquist Condition New

Specifications

Country of Origin United States
Brand Bergquist
Colour Tan
THICKNESS 0.13mm
Length 35mm
Model CPU PAD 35X35
Width 35mm
Series CPU PAD
Maximum Operating Temperature 150°C
Thermal Conductivity 0.6W/mK
Minimum Operating Temperature 50°C
Standards/Approvals RoHS
Trade Name CPU PAD
Conductive Material Acrylic

Key Features

  • The pad thickness is 0.13 mm ensuring a thin yet efficient thermal pathway.
  • Thermal conductivity is rated at 0.6 W/mK for reliable heat transfer.
  • Made from acrylic material with a tan color providing electrical insulation and thermal conduction.
  • Self-adhesive on both sides for secure installation and ease of use.
  • Suitable for operating temperatures ranging from -50°C to 150°C.
  • Complies with RoHS standards ensuring environmental safety and quality.
  • Manufactured in the United States assuring high production standards.

Product Description

Bergquist CPU PAD 35X35 is a self-adhesive thermal interface pad specially engineered for enhancing heat dissipation in electronics cooling applications. This pad features a thickness of 0.13 mm that provides a minimal gap between components, optimizing thermal conductivity at 0.6 W/mK. Its compact size of 35 mm by 35 mm suits PGA type coolers and microprocessor modules, making it ideal for precise assembly in electronic systems.

Constructed from acrylic material with a tan color, the CPU PAD serves dual purposes by providing electrical insulation and efficient thermal conduction. The self-adhesive property on both sides facilitates a secure and quick installation, reducing assembly time and maintaining component stability.

The pad is rated for a wide operating temperature range from -50°C to 150°C, enabling usage in various industrial, laboratory, and commercial electronics environments. Compliance with RoHS standards guarantees that the product meets stringent environmental and safety criteria.

Manufactured in the United States, this CPU PAD upholds excellent quality control and consistency. Bergquist’s CPU PAD series is widely used in applications ranging from industrial automation equipment to consumer electronics where thermal management is critical.

The pad thickness is 0.13 mm ensuring minimal thermal interface gap. Thermal conductivity rated at 0.6 W/mK for effective heat dissipation. Dimensions measure precisely 35 mm by 35 mm, compatible with PGA coolers. Made from acrylic material providing electrical insulation and thermal transfer.

Self-adhesive on both sides for easy and secure application on components. Temperature range supports operation from -50°C to 150°C. RoHS compliant, aligning with environmental and safety standards. Manufactured in the United States with quality assurance.

Explore the Electronics Components category on EnvMart for more thermal management solutions including Thermal Pads, greases, and insulating materials from trusted brands like Bergquist.

Bergquist CPU PAD Series Self-Adhesive Thermal Interface Pad, 0.13 mm Thick, 0.6 W/mK Thermal Conductivity, 35 CPU PAD 35X35
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Frequently Asked Questions

The thickness of this thermal interface pad is 0.13 mm, ensuring a minimal thermal interface gap.

The thermal conductivity of the CPU PAD 35X35 is rated at 0.6 W/mK, which facilitates effective heat dissipation.

This thermal pad measures 35 mm by 35 mm, making it suitable for PGA type coolers and microprocessor modules.

The CPU PAD 35X35 can operate within a temperature range of -50°C to 150°C, suitable for various electronic applications.

This thermal interface pad is constructed from acrylic material, providing both electrical insulation and thermal conduction.

Yes, this model features a self-adhesive property on both sides, allowing for secure and easy installation on components.

The pad complies with RoHS standards, ensuring it meets environmental and safety criteria.

This thermal interface pad is manufactured in the United States, assuring high production standards.

It is widely used in applications ranging from industrial automation equipment to consumer electronics where thermal management is critical.

The thermal pad is tan in color, which is characteristic of its acrylic material.

The trade name for this product is CPU PAD, which is part of the Bergquist series.

This model is engineered for enhancing heat dissipation in electronics cooling applications, optimizing thermal conductivity between components.

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