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Wurth Elektronik WE-TINS Series Thermal Gap Pad, 0.23 mm Thickness, 1.6 W/mK Thermal Conductivity, 300 mm Length x 404016015
Specifications
| Country of Origin | India |
|---|---|
| Brand | Wurth Elektronik |
| THICKNESS | 0.23mm |
| Length | 300mm |
| Width | 300mm |
| Series | WE-TINS |
| Maximum Operating Temperature | 200°C |
| Thermal Conductivity | 1.6W/mK |
| Minimum Operating Temperature | -60°C |
| Trade Name | Würth Elektronik eiSos GmbH & Co. KG |
| Conductive Material | Ceramic Filled Silicone Rubber |
Key Features
- Ceramic filled silicone rubber ensures effective thermal interface performance.
- Operating temperature ranges from -60°C to 200°C for versatile use.
- Compliant with REACh, RoHS, and halogen-free standards.
- Ideal for filling air gaps and uneven surfaces between heatsinks and electronic devices.
- View all in Thermal PadsSearch for similar productsTechnical DocumentsRoHS Certificate of ComplianceStatement of ConformitySpecificationsBrandWurth ElektronikProduct TypeThermal Gap PadThickness0.23mmThermal Conductivity1.6W/mKTrade NameWü
- A thermal pad is particularly useful where air gaps, rough su
- Home/Electrical, Automation & Cables/HVAC, Fans & Thermal Management/Electronics Heating & Cooling Components/Thermal Pads
- Wurth Elektronik WE-TINS Series Thermal Gap Pad, 0.23 mm Thick, 1.6 W/mK, 300 mm, 300mm, Ceramic Filled Silicone RubberRS Stock No.: 242-0164Brand: Wurth ElektronikManufacturers Part No.: 404016015Distrelec Article No.: 30253109
Product Description
Wurth Elektronik 404016015 WE-TINS Series Thermal Gap Pad is a high-performance material designed to provide a thermal interface between heatsinks and electronic devices. With a thickness of 0.23 mm and thermal conductivity of 1.6 W/mK, this ceramic filled silicone rubber pad effectively fills air gaps, rough textures, and uneven surfaces that can impede heat transfer.
The pad measures 300 mm by 300 mm, offering ample coverage for various thermal management applications. It operates safely within the temperature range from -60°C to +200°C, making it suitable for demanding industrial environments including electronics cooling, HVAC systems, and other thermal management uses.
This thermal gap pad conforms to REACh and RoHS regulations and is certified halogen free according to JEDEC JS709B and IEC 61249-2-21 standards, ensuring environmental and safety compliance. It is ideal in electronics manufacturing, laboratory equipment, and industrial applications requiring reliable heat dissipation.
Ceramic filled silicone rubber offers durable thermal conduction. Thickness of 0.23 mm enables close contact between components. Large 300 mm x 300 mm size suitable for various device interfaces. Wide operating temperature range supports diverse conditions.
Compliant with multiple international safety and environmental standards.
The Wurth Elektronik WE-TINS Series Thermal Gap Pad is a trusted solution in thermal management, supporting efficient heat dissipation in industrial, electronics, HVAC, and laboratory applications. Explore more thermal interface materials and components for optimized performance at EnvMart.
Explore more products in our Thermal Pads category.
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Frequently Asked Questions
The thickness of this thermal gap pad is 0.23 mm.
It has a thermal conductivity of 1.6 W/mK, which enables effective heat transfer.
This thermal gap pad measures 300 mm in length and 300 mm in width.
The maximum operating temperature for this model is 200°C.
The minimum operating temperature is -60°C, allowing for use in diverse environments.
It is made from ceramic filled silicone rubber, which provides effective thermal interface performance.
Yes, it complies with REACh, RoHS, and is certified halogen-free according to JEDEC JS709B and IEC 61249-2-21 standards.
It is suitable for electronics cooling, HVAC systems, and other thermal management applications requiring reliable heat dissipation.
It effectively fills air gaps and uneven surfaces between heatsinks and electronic devices, enhancing thermal conduction.
The trade name is Würth Elektronik.
It is manufactured in India.
It is designed for providing a thermal interface between heatsinks and electronic devices, ensuring effective thermal management.
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