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Wurth Elektronik Thermal Gap Pad WE-TGFG Series, 20 mm Thick, 1800 W/mK Thermal Conductivity, 15 mm x 15 mm 407150015200

Category Thermal Pads Brand Wurth Elektronik Condition New

Specifications

Country of Origin India
Brand Wurth Elektronik
Colour Black
THICKNESS 20mm
Length 15mm
Width 15mm
Series WE-TGFG
Maximum Operating Temperature 120°C
Thermal Conductivity 1800W/mK
Minimum Operating Temperature -40°C
Standards/Approvals RoHS
Trade Name Würth Elektronik
Conductive Material Acrylic and Graphite

Key Features

  • This thermal gap pad is 20 mm thick, providing an effective thermal interface.
  • It features a high thermal conductivity rating of 1800 W/mK.
  • Constructed from acrylic and graphite materials for optimal heat transfer.
  • Operates reliably within a temperature range of -40°C to 120°C.
  • Black color and RoHS compliant ensuring environmental safety.
  • Part of the WE-TGFG series by Wurth Elektronik, known for quality thermal management solutions.
  • Ideal for electronic device cooling where air gaps or uneven surfaces exist.

Product Description

Wurth Elektronik 407150015200 Thermal Gap Pad WE-TGFG Series is a precise thermal interface material designed to improve heat dissipation between heatsinks and electronic components. The pad is composed of acrylic and graphite, materials selected for their excellent thermal conduction properties and durability.

This thermal pad measures 15 mm by 15 mm, making it suitable for compact and precise electronic assemblies. The black pad is RoHS compliant, adhering to international environmental standards, and is approved for use within an operating temperature range from -40°C up to 120°C, ensuring reliable performance in diverse industrial and manufacturing environments.

Typical use cases include HVAC systems, industrial electronics, thermal management in electrical devices, and applications that require effective heat transfer without mess or complexity of liquid thermal compounds. Its durable construction supports long-term use in tough industrial conditions, including manufacturing, laboratory equipment, and automated electronic assemblies.

The WE-TGFG series represents Wurth Elektronik's commitment to high quality in thermal interface materials, providing engineers with a reliable solution to enhance thermal conductivity and protect sensitive electronic components.

This thermal gap pad is 20 mm thick, providing an effective thermal interface. It features a high thermal conductivity rating of 1800 W/mK. Constructed from acrylic and graphite materials for optimal heat transfer. Dimensions are 15 mm length and 15 mm width, suitable for compact applications.

Operates reliably within a temperature range of -40°C to 120°C. Black color and RoHS compliant ensuring environmental safety. Part of the WE-TGFG series by Wurth Elektronik, known for quality thermal management solutions.

Ideal for electronic device cooling where air gaps or uneven surfaces exist.

Explore EnvMart's full range of thermal interface materials and Thermal Pads for industrial, laboratory, HVAC, and manufacturing applications to find the right product for your thermal management needs.

Wurth Elektronik Thermal Gap Pad WE-TGFG Series, 20 mm Thick, 1800 W/mK Thermal Conductivity, 15 mm x 15 mm 407150015200
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Frequently Asked Questions

The thermal gap pad has a thickness of 20 mm.

It features a high thermal conductivity rating of 1800 W/mK.

The pad measures 15 mm by 15 mm in length and width.

It is constructed from acrylic and graphite materials for optimal heat transfer.

It operates reliably within a temperature range of -40°C to 120°C.

Yes, the thermal gap pad is RoHS compliant, ensuring it meets environmental safety standards.

Typical use cases include HVAC systems, industrial electronics, and thermal management in electrical devices.

This thermal gap pad is part of the WE-TGFG series by Wurth Elektronik.

The thermal gap pad is black in color.

The country of origin for this thermal gap pad is India.

The trade name of this thermal gap pad is Wurth Elektronik.

It improves heat dissipation between heatsinks and electronic components, making it ideal for applications with air gaps or uneven surfaces.

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