KEMET C0603C563K5RACTU Multilayer Ceramic Capacitor is a high-quality passive electronic component designed for surface mount technology. It features a capacitance of 56 nF and rated for 50V DC operation with a tolerance of ±10 %, suitable for precision electronic circuits requiring stable capacitance.
Constructed with a stacked design inside a compact 0603 package, the capacitor has dimensions of 1.6 mm in length, 0.8 mm in width, and 0.8 mm in height, making it ideal for space-constrained applications.
This capacitor utilizes a Class II X7R dielectric material, providing excellent temperature stability from −55°C to +125°C. This dielectric ensures capacitance changes are limited to ±30 ppm/°C within the operating temperature range, making it reliable for industrial and commercial electronics.
The device is lead (Pb)-free and fully RoHS and REACH compliant, confirming adherence to environmental standards. It features a 100% pure matte tin-plated solder termination finish for superior solderability on printed circuit boards and also offers a SnPb termination option upon request.
Applications include decoupling, filtering, timing circuits, and general signal conditioning in electronic equipment used across industrial, telecommunications, consumer electronics, and automotive sectors.
56 nF capacitance with ±10 % tolerance. Voltage rating of 50V DC suitable for many consumer and industrial electronic circuits. Class II X7R dielectric providing temperature stability. 0603 surface mount package dimensions of 1.6mm x 0.8mm x 0.8mm.
RoHS and REACH compliant, lead-free construction. Maximum operating temperature of 125°C ensuring durability under harsh conditions. Solder termination type ensures compatibility with standard SMT assembly processes. Suitable for electrical isolation, bypassing, and energy storage in various electronics.
This capacitor is categorized under Multilayer Ceramic Capacitors commonly used in electronics manufacturing, laboratory equipment, communications gear, and automotive electronic modules. Its compact design meets modern device miniaturization requirements.
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