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Isocom Optocoupler, Surface Mount 8-Pin DIP Phototransistor Output, 1.3V Forward Voltage, 50mA Input Current TLP521-2GB
Specifications
| Country of Origin | Thailand |
|---|---|
| Brand | Isocom |
| Model | TLP521-2GB |
| Packaging | Tube |
| Mount Type | Surface |
| Output type | Phototransistor |
| Series | TLP521 |
| Maximum Operating Temperature | 100°C |
| Package Type | DIP |
| Minimum Operating Temperature | -30°C |
| Maximum input current | 50mA |
| Standards/Approvals | UL |
| Maximum Forward Voltage | 1.3V |
| Number of Pins | 8 |
| Typical Rise Time | 4μs |
| Maximum Current Transfer Ratio | 600% |
| Typical Fall Time | 3μs |
| Minimum Current Transfer Ratio | 200% |
Key Features
- Mount type is surface, suitable for PCB assembly.
- Phototransistor output delivers responsive optocoupling.
- Maximum forward voltage is 1.3 volts for input LED.
- Encapsulated in a tube package with 8 pins in DIP form factor.
- Typical rise time of 4 microseconds ensures fast switching.
- Maximum input current rating is 50 milliamps.
- Operating temperature ranges from -30°C to 100°C.
- Current transfer ratio ranges between 200% minimum and 600% maximum.
Product Description
Isocom TLP521-2GB optocoupler is a precision electronic component intended for signal isolation in electronic circuits, featuring a surface mount 8-pin dual in-line package (DIP) with phototransistor output. It supports a maximum forward voltage of 1.3V with a maximum input current of 50mA, making it well-suited for interfacing and isolating low voltage signals in industrial, laboratory, and electronic manufacturing applications.
This optocoupler exhibits fast response times with a typical rise time of 4 microseconds and a fall time of 3 microseconds, ensuring reliable switching performance. It can operate safely within a temperature range from -30°C to 100°C, accommodating demanding environmental conditions.
The device provides a current transfer ratio ranging from 200% to 600%, allowing efficient signal transfer from input to output. Its UL standards approval guarantees high reliability and safety standards compliance. The compact DIP package is convenient for through-hole mounting on printed circuit boards.
Common applications include industrial automation, signal isolation in power supplies, microcontroller interfaces, and communication systems. The TLP521 series from Isocom delivers consistent performance for electronic component designers and system integrators.
Surface mount 8-pin DIP configuration for easy PCB integration. Phototransistor output suitable for various optoelectronic isolation needs. Fast typical rise and fall times of 4μs and 3μs respectively. Operating temperatures between -30°C and 100°C for versatile use.
Maximum forward voltage of 1.3V and input current of 50mA. High current transfer ratio from 200% to 600% ensures signal integrity. UL approved for industry-standard reliability and safety. Manufactured in Thailand ensuring quality and compliance.
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Frequently Asked Questions
The maximum operating temperature of this model is 100°C.
It has a typical rise time of 4 microseconds.
The maximum forward voltage for the TLP521-2GB is 1.3 volts.
The maximum input current rating for this model is 50 milliamps.
The current transfer ratio ranges from a minimum of 200% to a maximum of 600%.
This model features a phototransistor output.
The optocoupler has 8 pins in a dual in-line package (DIP) configuration.
The typical fall time for this unit is 3 microseconds.
It is manufactured in Thailand.
This model is designed for surface mounting, suitable for PCB assembly.
The optocoupler is UL approved, ensuring compliance with industry standards for reliability and safety.
It is suitable for applications such as industrial automation, signal isolation in power supplies, and microcontroller interfaces.
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