Sunhayato Copper Clad Board Synthetic Resin Bonded Paper 35 μm Copper Thickness 150 mm 15

Sunhayato 15 Copper Clad Board Synthetic Resin Bonded Paper with 35 μm copper thickness and 150 mm length is an essential material for electronic prototyping, PCB fabrication, and related applications. Manufactured in Japan with FR1 flame retardant material grade, the board provides reliable mechanical strength and conductivity for diverse electronic uses.

This copper clad board features a synthetic resin bonded paper base that ensures durability and ease of handling during assembly and soldering processes. The single-sided copper cladding is 35 microns thick, suitable for most prototyping and low power circuit designs.

The 1.6 mm thickness of the board provides a stable substrate for mounting electronic components, maintaining dimensional stability under thermal cycling. With a length of 150 mm, this board is ideal for a variety of experimental, developmental, and small-scale production scenarios.

While no specific certifications or approvals are listed, the manufacturing quality and material selection from Sunhayato ensure compliance with common industrial expectations for PCB raw materials.

Applications include engineering prototyping, educational electronics, hobbyist PCB creation, and low-volume manufacturing environments. The board supports soldering, drilling, and component mounting processes efficiently.

The board material is synthetic resin bonded paper ensuring durability. Single-sided copper cladding with 35 μm thickness provides reliable conductivity. FR1 material grade offers flame retardant properties suitable for electronics.

The board thickness is 1.6 mm, offering stable mechanical support. Manufactured in Japan following industry standards without specific approvals. Ideal for PCB prototyping, electronic component testing, and DIY projects.

The 150 mm length size fits small to medium circuit designs. Explore more prototyping and Copper Clad Boards at EnvMart for versatile and quality electronic components.