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Multicore Lead Free Solder Wire 0.23 mm Diameter, 217 °C Melting Point, Activated Rosin Flux 250g Malaysia 289751
Specifications
| Country of Origin | Malaysia |
|---|---|
| Brand | Multicore |
| Model | 289751 |
| Melting Point | 217°C |
| Product Weight | 250g |
| Wire Diameter | 0.23mm |
| Product Form | Wire |
| Percent Lead | 0% |
| Percent Silver | 3.8% |
| Percent Tin | 95.5% |
| Flux Type | Activated Rosin |
| Percent Copper | 0.7% |
| Multicore Wire, 1.2 mm Lead Free Solder, 227 °C Melting PointBrand | Multicore |
| Stannol Wire, 0.23mm Solder, 183°C Melting PointBrand | Stannol |
Key Features
- Wire diameter is 0.23 mm for detailed soldering work.
- Contains 0% lead, making it environmentally friendly and RoHS compliant.
- Melting point of 217 °C supports stable soldering temperatures.
- Composed of 95.5% tin, 3.8% silver, and 0.7% copper for optimal conductivity.
- Flux type is activated rosin, providing clean solder joints with clear residue.
- Product weight is 250 grams, suitable for various electronic soldering tasks.
- Manufactured in Malaysia ensuring quality and reliability.
Product Description
Multicore 289751 is a lead free solder wire designed for professional electronics soldering applications, featuring a fine diameter of 0.23 mm and a melting point at 217 °C. This solder wire incorporates a flux core with activated rosin, which promotes high speed soldering and produces a clear residue, ensuring clean and reliable solder joints.
Composition consists of 95.5% tin, 3.8% silver, and 0.7% copper, offering excellent electrical conductivity and mechanical strength suitable for complex electronic assemblies. The product weighs 250 grams and is compliant with standards such as J-STD-004 and EN29453, guaranteeing high quality and safe use in industrial and laboratory environments.
This solder wire is ideal for use in the manufacturing, repair, and prototyping of electronic components, providing consistent and low-spatter soldering performance. Wire diameter is 0.23 mm for detailed soldering work. Contains 0% lead, making it environmentally friendly and RoHS compliant.
Melting point of 217 °C supports stable soldering temperatures. Composed of 95.5% tin, 3.8% silver, and 0.7% copper for optimal conductivity. Flux type is activated rosin, providing clean solder joints with clear residue.
Product weight is 250 grams, suitable for various electronic soldering tasks. Manufactured in Malaysia ensuring quality and reliability.
Use cases include industrial electronics manufacturing, laboratory prototype building, and precise electrical repairs. This solder wire delivers reliable performance with minimal fume and spatter, ideal for professional usage.
Explore other Solder Wire options and related soldering accessories in the EnvMart catalogue for comprehensive solutions.
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Frequently Asked Questions
The wire diameter of this solder wire is 0.23 mm, making it suitable for detailed soldering work.
The melting point of this solder wire is 217 °C, which supports stable soldering temperatures.
This solder wire is composed of 95.5% tin, 3.8% silver, and 0.7% copper, providing optimal conductivity.
The solder wire uses activated rosin flux, which promotes clean solder joints with clear residue.
The product weight is 250 grams, making it suitable for various electronic soldering tasks.
Yes, this solder wire contains 0% lead, making it environmentally friendly and compliant with RoHS standards.
This solder wire is manufactured in Malaysia, ensuring quality and reliability.
Activated rosin flux helps achieve high-speed soldering and produces minimal fume and spatter, ensuring clean and reliable solder joints.
This solder wire complies with standards such as J-STD-004 and EN29453, ensuring high quality and safe use.
The composition of 95.5% tin, 3.8% silver, and 0.7% copper provides excellent electrical conductivity suitable for complex electronic assemblies.
The fine diameter of 0.23 mm allows for detailed soldering work, making it suitable for intricate electronic components.
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