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Multicore Lead Free Solder Wire 0.5 mm Diameter 217 °C Melting Point Sn95.5 Ag3.8 Cu0.7 Activated Rosin Flux 250g 583729
Specifications
| Country of Origin | Malaysia |
|---|---|
| Brand | Multicore |
| Model | 583729 |
| Melting Point | 217°C |
| Product Weight | 250g |
| Wire Diameter | 0.5mm |
| Product Form | Wire |
| Percent Lead | 0% |
| Percent Silver | 3.8% |
| Percent Tin | 95.5% |
| Flux Type | Activated Rosin |
| Percent Copper | 0.7% |
| MBO Wire, 0.5 mm Lead Free Solder, 217 °C Melting PointBrand | MBO |
Key Features
- The solder wire contains 0% lead for eco-friendly use and complies with modern environmental standards.
- It has a precise diameter of 0.5 mm ideal for delicate and detailed soldering tasks.
- Contains 95.5% tin, 3.8% silver, and 0.7% copper to ensure strong, reliable joints.
- Incorporates activated rosin flux for excellent wetting and minimal residue.
- Melting point is 217 °C, suitable for a wide range of soldering operations.
- Halide-free formulation reduces corrosive effects and contamination.
- The wire is supplied on a spool weighing 250 grams for convenient use and storage.
- Originates from Malaysia, ensuring consistent quality and manufacturing standards.
Product Description
Multicore 583729 Lead Free Solder Wire is a high-quality soldering consumable intended for precise electronic assembly, repair, and manufacturing tasks. Its 0.5 mm diameter allows for controlled application, while the lead-free composition (0% lead) aligns with environmental safety standards and regulations.
The solder wire features a melting point of 217 °C, making it suitable for a wide range of electronics and electrical soldering applications. The alloy composition includes 95.5% tin, 3.8% silver, and 0.7% copper, which ensures strong mechanical and electrical connection characteristics.
This product integrates an activated rosin flux that promotes rapid wetting and strong bonding on copper, brass, and nickel materials. The halide-free nature of the flux minimizes corrosive residues, reducing damage risks and cleaning requirements post-soldering.
The wire is conveniently supplied on a spool weighing 250 grams, facilitating ease of use and storage in professional workshops and manufacturing environments.
This solder wire complies with standards such as J-STD-004 and EN29453, reflecting its quality and reliability for industrial, laboratory, electronics manufacturing, and repair use cases.
The solder wire contains 0% lead for eco-friendly use and complies with modern environmental standards. It has a precise diameter of 0.5 mm ideal for delicate and detailed soldering tasks. Contains 95.5% tin, 3.8% silver, and 0.7% copper to ensure strong, reliable joints.
Incorporates activated rosin flux for excellent wetting and minimal residue. Melting point is 217 °C, suitable for a wide range of soldering operations. Halide-free formulation reduces corrosive effects and contamination.
The wire is supplied on a spool weighing 250 grams for convenient use and storage. Originates from Malaysia, ensuring consistent quality and manufacturing standards. Designed for use on copper, brass, and nickel surfaces with good spreadability.
Explore EnvMart's comprehensive Solder Wire offerings for trusted soldering consumables that deliver consistent performance in diverse industrial and electronics assembly settings.
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Frequently Asked Questions
The melting point of this solder wire is 217 °C, making it suitable for a wide range of soldering applications.
This solder wire has a precise diameter of 0.5 mm, which is ideal for delicate and detailed soldering tasks.
The solder wire contains 95.5% tin, 3.8% silver, and 0.7% copper, ensuring strong mechanical and electrical connections.
Yes, this solder wire contains 0% lead, aligning with modern environmental standards for eco-friendly use.
It incorporates activated rosin flux, which promotes excellent wetting and minimizes residue during soldering.
The solder wire is supplied on a spool weighing 250 grams, facilitating ease of use and storage.
This solder wire originates from Malaysia, ensuring consistent quality and manufacturing standards.
This solder wire is intended for precise electronic assembly, repair, and manufacturing tasks, particularly on copper, brass, and nickel surfaces.
Yes, it complies with standards such as J-STD-004 and EN29453, reflecting its quality and reliability.
The halide-free formulation reduces corrosive effects and contamination, minimizing damage risks and cleaning requirements post-soldering.
The 0.5 mm diameter allows for controlled application, making it suitable for intricate soldering tasks in electronics.
Activated rosin flux enhances wetting properties and promotes strong bonding, which is crucial for effective soldering on various materials.
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