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Sunhayato Extender Board Converter Board 208 Way 2 Sides Epoxy Glass Fabric Laminate FR4 1mm Thickness 77.47mm QFP-51

Category Extender Boards & Adapter Boards Brand Sunhayato Condition New

Specifications

Country of Origin Japan
Brand Sunhayato
Length 77.47mm
Model QFP-51
Width 77.47mm
Sub Type Converter Board
Interfaces lands
Board Material Epoxy Glass Fabric Laminate
Number of Contacts 208
Number of Sides 2
Board Thickness 1mm
FR Material Grade FR4

Key Features

  • The board has a thickness of 1mm and dimensions of 77.47 x 77.47 mm for precise integration.
  • Constructed using durable FR4 material grade for enhanced mechanical stability.
  • This converter board allows soldering of ICs centrally with wires connected through nearby lands.
  • Designed to accommodate ICs with fewer pins towards the center of the pattern for compatibility.
  • Manufactured in Japan, ensuring high quality and consistent performance.
  • Suitable for ESD control, cleanroom environments, and PCB prototyping tasks.
  • The board is specifically made for 208 way connections enabling complex circuit connections.
  • No additional certifications or approvals apply to this product.

Product Description

Sunhayato QFP-51 Extender Board Converter Board is a high-quality prototyping component with 208 contacts arranged on both sides of the board. Made from Epoxy Glass Fabric Laminate with FR4 material grade, this 1mm thick board measures 77.47 mm by 77.47 mm, providing a robust and stable platform for converting QFP IC footprints.

The board design facilitates the soldering of ICs at its center, with connections brought out via nearby lands, which is ideal for use with ICs that have fewer pins at the center of the pattern. This feature ensures versatility when working with a variety of integrated circuits during development and testing.

Manufactured in Japan, the board delivers consistent quality and durability necessary for demanding industrial, laboratory, and electronics prototyping environments. It serves well in ESD control and cleanroom conditions where sensitive electronic components are handled.

Key features include a 2-sided layout enabling complex circuitry, an epoxy glass fabric laminate material ensuring mechanical strength, and precise dimensions suitable for high-density electronic assembly. This converter board is an essential tool for prototyping and developing advanced electronics systems.

The board has a thickness of 1mm and constructed using FR4 material grade. Offers 208 contact points arranged on 2 sides for extensive prototyping capability. Supports soldering of QFP ICs centered on the board with wire connections on lands.

Manufactured in Japan to ensure high quality and reliability. Ideal for ESD control, cleanroom, and PCB prototyping applications.

Sunhayato products are recognized for precision engineering, supporting electronics manufacturing, research, and development sectors. Explore the full range of extender boards and adapter boards for enhanced prototyping solutions on EnvMart.

Explore more products in our Extender Boards & Adapter Boards category.

Sunhayato Extender Board Converter Board 208 Way 2 Sides Epoxy Glass Fabric Laminate FR4 1mm Thickness 77.47mm QFP-51
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Frequently Asked Questions

The board measures 77.47 mm by 77.47 mm and has a thickness of 1 mm.

It features a total of 208 contacts arranged on both sides of the board.

The board is constructed from Epoxy Glass Fabric Laminate with an FR4 material grade.

Yes, it is designed to be suitable for ESD control and cleanroom environments.

It allows for the soldering of QFP ICs centrally, particularly those with fewer pins towards the center of the pattern.

This converter board is manufactured in Japan, ensuring consistent quality and performance.

The contacts are arranged on both sides of the board, enabling complex circuit connections.

It is primarily used for prototyping and developing advanced electronics systems.

The board has a thickness of 1 mm.

It supports connections through lands for interfacing with other components.

The model number is QFP-51.

The design allows for soldering ICs at its center, with connections brought out via nearby lands.

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