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Ezurio Development Module Bluetooth BT860Sx Module Soldered with Motherboard 2.44GHz UART I2S GPIO USB DVK-BT860-ST

Specifications

Country of Origin Taiwan
Brand Ezurio
Model DVK-BT860-ST
Technology Bluetooth Module
Interface Type I2S, UART, GPIO, USB
For Use With Bluetooth Module
Maximum Frequency 2.44GHz
Kit Classification Development Module, Bluetooth Development Tools
Featured Device BT860Sx module soldered with motherboard
Kit Name DVK-BT860-ST
RF Technology Bluetooth

Key Features

  • Equipped with Cypress CYW20704 A2 chipset for low power consumption.
  • Supports Classic Bluetooth and Bluetooth Low Energy modes.
  • Operates at a maximum frequency of 2.44 GHz.
  • Includes UART, I2S, GPIO, and USB interfaces for flexible connectivity.
  • Provides integrated or external antenna options for excellent RF performance.
  • Compliant with Bluetooth 5 core specification for enhanced throughput and security.
  • Operating temperature range from -30 °C to 85 °C.
  • Certified by FCC, ISED, EU, MIC, KC, AS-NZS, and Bluetooth SIG.

Product Description

Ezurio DVK-BT860-ST Bluetooth Development Module with BT860Sx chip soldered on motherboard is designed to provide an efficient Bluetooth connectivity solution for developers and OEMs. Featuring the Cypress CYW20704 A2 chipset, this development kit offers low power consumption and supports both Classic Bluetooth and Bluetooth Low Energy (BLE) modes, aligning with the Bluetooth 5 core specification. This reduces development time while enhancing throughput, security, and privacy.

The module operates at a maximum frequency of 2.44 GHz and includes multiple interfaces such as UART, I2S, GPIO, and USB, enabling versatile integration into various projects. For flexible antenna configurations, the module supports either an integrated antenna or an external antenna via a trace pad, ensuring excellent RF performance for a range of applications.

Designed to meet the needs of industrial, laboratory, and development environments, this Bluetooth module facilitates seamless wireless communication for prototypes, embedded devices, and wireless sensor systems. It operates reliably within a temperature range of -30 °C to 85 °C, suitable for diverse operating conditions.

Equipped with Cypress CYW20704 A2 chipset for low power operation and dual Bluetooth mode. Supports UART, I2S, GPIO, and USB interfaces for flexible connectivity. Bluetooth 5 compliance ensures enhanced features and security.

Operating temperature range from -30 °C to 85 °C for robust performance. Offers integrated and external antenna options for RF flexibility. Certified by multiple international standards including FCC and Bluetooth SIG.

The Ezurio DVK-BT860-ST is ideal for use in communication and wireless development tools, especially in domains such as industrial automation, IoT device development, and embedded systems design.

Explore EnvMart for a comprehensive range of communication modules and development kits to support your electronics design and prototyping requirements.

Explore more products in our Communication & Wireless Development Tools category.

Ezurio Development Module Bluetooth BT860Sx Module Soldered with Motherboard 2.44GHz UART I2S GPIO USB DVK-BT860-ST
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Frequently Asked Questions

The Ezurio DVK-BT860-ST module operates at a maximum frequency of 2.44 GHz.

This module includes UART, I2S, GPIO, and USB interfaces for flexible connectivity.

The operating temperature range for the DVK-BT860-ST is from -30 °C to 85 °C.

It supports both Classic Bluetooth and Bluetooth Low Energy (BLE) modes.

The module is equipped with the Cypress CYW20704 A2 chipset, which is designed for low power consumption.

Yes, it is certified by FCC, ISED, EU, MIC, KC, AS-NZS, and Bluetooth SIG.

The module supports both integrated and external antenna options for flexible RF performance.

This module is suitable for industrial automation, IoT device development, and embedded systems design.

The kit is classified as a Development Module and Bluetooth Development Tools.

The country of origin for the Ezurio DVK-BT860-ST is Taiwan.

The primary technology used in this module is Bluetooth.

The featured device in this development module is the BT860Sx module soldered with the motherboard.

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