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Ezurio Bluetooth Development Board with BT850Sx Module Soldered, GPIO USB I2S Interface, 2.44GHz DVK-BT850-ST
Specifications
| Country of Origin | Taiwan |
|---|---|
| Brand | Ezurio |
| Model | DVK-BT850-ST |
| Interface Type | GPIO, USB, I2S |
| For Use With | BT850-ST |
| Standards/Approvals | FCC, ISED, EU, UKCA, MIC, KC, AS/NZS, Bluetooth SIG |
| Maximum Frequency | 2.44GHz |
| Kit Classification | Bluetooth Development Tools, Development Module |
| Featured Device | BT850Sx module soldered with motherboard |
| Kit Name | DVK BT850 ST |
| RF Technology | Bluetooth |
Key Features
- Utilizes Cypress CYW20704 A2 chipset for low power consumption and high performance.
- Supports both Classic Bluetooth and Bluetooth Low Energy (BLE) connections.
- Offers GPIO, USB, I2S, and PCM audio interfaces for flexible integration.
- Includes integrated or external antenna options via SMT pad.
- Ideal for OEMs needing Bluetooth communication with enhanced throughput and security.
- Kit classification includes Bluetooth Development Tools and Development Module.
- Designed specifically for use with BT850-ST boards.
- Manufactured in Taiwan, Province of China.
Product Description
Ezurio DVK-BT850-ST Bluetooth Development Board integrates the BT850Sx module soldered with a motherboard, operating at a maximum frequency of 2.44GHz. Powered by the Cypress CYW20704 A2 chipset, this board delivers exceptionally low power consumption while supporting both Classic Bluetooth and Bluetooth Low Energy (BLE), aligned with the Bluetooth 5 core specification.
This board supports multiple interface types including GPIO, USB, I2S, and PCM audio interfaces, providing maximum flexibility for integration into diverse systems. The module offers antenna options with an integrated antenna or an external antenna via SMT pad for optimal RF performance.
Ideal for industrial and commercial applications, the Ezurio DVK-BT850-ST is well-suited for communication and wireless development projects including IoT devices, embedded systems, and Bluetooth connectivity solutions. It supports up to 7 Bluetooth connections simultaneously and includes coexistence features such as Cypress GCI coexistence (2-wire) for improved integration in RF-rich environments.
The product is classified under Bluetooth Development Tools and Development Modules and is built with a focus on compact size and excellent RF performance. Utilizes Cypress CYW20704 A2 chipset for efficient Bluetooth 5 communication.
Supports Classic Bluetooth and Bluetooth Low Energy (BLE) protocols. Offers versatile interface types: GPIO, USB, I2S, and PCM audio. Dual antenna options: integrated or external via SMT pad. Compatible with BT850-ST series for reliable wireless development.
Manufactured in Taiwan, Province of China. Supports up to 7 simultaneous Bluetooth connections. Certified to multiple international standards including FCC and Bluetooth SIG. Ideal for industrial, manufacturing, and IoT applications.
This development board is a valuable tool for engineers and developers working on Bluetooth communication modules and wireless system integration. Explore more Bluetooth Modules and development tools on EnvMart for advanced wireless communication solutions.
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Frequently Asked Questions
The maximum frequency of this development board is 2.44GHz.
It can support up to 7 simultaneous Bluetooth connections.
It utilizes the Cypress CYW20704 A2 chipset, which is designed for low power consumption and high performance.
Yes, it is specifically designed for use with BT850-ST boards.
It is certified to multiple international standards including FCC, ISED, EU, UKCA, MIC, KC, AS/NZS, and Bluetooth SIG.
The kit classification includes Bluetooth Development Tools and Development Module.
It is manufactured in Taiwan, Province of China.
This model is ideal for industrial, manufacturing, and IoT applications, particularly for Bluetooth communication and wireless development projects.
The primary technology used is Bluetooth, supporting both Classic Bluetooth and Bluetooth Low Energy (BLE).
The kit includes the BT850Sx module soldered with a motherboard, designed for various wireless development projects.
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