Arcol Ohmite Heatsink for TO-247 and TO-264 Devices, Thermal Resistance 3.89°C/W, Dimensions 55.12mm x 31.5mm x PV-T22-38E

The Arcol Ohmite PV-T22-38E heatsink is a forged pin-fin heatsink ideal for use with TO-247 and TO-264 semiconductor devices. It offers a thermal resistance of 3.89°C/W and compact form factor measuring 55.12mm in length, 31.5mm in width, and 38.61mm in height, making it suitable for constrained electronic packaging environments.

Featuring a degreased finish, this heatsink ensures optimal heat transfer and compatibility with various package types including TO-220 via non-standard cam clips. Its forged pin design enables effective forced convection cooling in multiple directions, enhancing cooling performance in both natural and forced convection applications.

The large surface area of 14823mm² promotes minimal thermal flow impedance, making it particularly effective for high power density electronic devices within 1U or 2U enclosure sizes. Vertical fastening facilitates easy PCB mounting and secure attachment.

This heatsink is suited for industrial, electrical, and HVAC applications where efficient thermal management of power components is critical. It is a reliable and compact thermal solution for manufacturing, laboratory, and commercial electronic systems.

Compatible with TO-264, TO-247, and TO-22 package types. Forged pin-fin construction for multidirectional airflow cooling. Degreased surface finish for superior heat dissipation. Vertical fastening mechanism for secure PCB mounting.

Surface area of 14823mm² for optimal thermal management. Compact dimensions suitable for 1U or 2U electronic packaging heights. Ideal for applications requiring natural and forced convection cooling. Manufactured in China with high-quality standards.

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