Arcol Ohmite Heatsink for CPU and GPU with PBGA, BGA Packages, Black Anodised Finish, 37.5mm x 37.5mm x 12.5mm BGAH375-125E

Arcol Ohmite BGAH375-125E is a high-quality heatsink designed for CPU and GPU thermal management in electronics cooling applications. This heatsink is specifically made to accommodate Ball Grid Array (BGA) and Plastic Ball Grid Array (PBGA) package types, commonly found in modern semiconductor devices. It features dimensions of 37.5 mm length, 37.5 mm width, and 12.5 mm height, providing an optimized thermal interface area.

The heatsink is constructed from aluminium alloy 6063-T5 or an equivalent grade, finished with a black anodised coating that improves heat dissipation and protects against corrosion. It mounts at the PCB level using PCB mounting techniques and does not require soldering, simplifying installation and maintenance.

The standard attachment method includes the use of adhesive thermal tape, which is provided in the heatsink kit. This allows easy and secure attachment to the target device, ensuring effective heat conduction. The heatsink is suitable for both natural (free) convection and forced convection cooling scenarios, making it versatile for various industrial and electronics thermal management applications.

Its surface area of 15,225 mm² facilitates efficient heat dissipation, enhancing device reliability and performance in cooling frameworks. This product is manufactured in China and complies with RoHS standards, confirming environmentally friendly material usage and production processes.

Typical applications include cooling electronic components such as CPUs, GPUs, and IC packages in computers, servers, telecommunications, and industrial electronics. The black anodised finish contributes to extended service life under demanding thermal conditions.

Environmental compatibility and performance consistency make the Arcol Ohmite BGAH375-125E heatsink a reliable choice for thermal management in electronics design and manufacturing.

The heatsink measures 37.5 mm in length and width, and 12.5 mm in height. Made from black anodised aluminium alloy 6063-T5 or equivalent. Utilizes PCB mount fastening with included thermal adhesive tape. Supports natural and forced convection cooling methods.

Provides a surface area of 15,225 mm² for effective heat transfer. Compatible with PBGA and BGA package types for CPU and GPU cooling. Manufactured in China and RoHS compliant. Explore the range of electronics cooling solutions and Heatsinks available at EnvMart for industrial and commercial applications.