Skyworks Solutions Inc 6-Channel Digital Isolator 150 Mbps, 2.5 kVrms Isolation, 5.5V Supply, 16-Pin SOIC Si8663BB-B-IS1

Skyworks Solutions Inc Si8663BB-B-IS1 is a 6-channel digital isolator IC designed to provide isolation and signal transmission in industrial, automotive, and communications applications. Featuring a high maximum data rate of 150 Mbps, it employs proprietary capacitive isolation technology to enable low propagation delay and skew, low emissions, and high noise immunity for dependable performance.

It supports up to six differential digital channels in a compact 16-pin SOIC package suitable for surface mount assembly. The device operates at a supply voltage of 5.5 V and dissipates a maximum power of 415 mW, making it efficient for embedded systems requiring effective isolation without excessive heat generation.

With a propagation delay time of 13 ns and rise time of 4 ns, it enables fast switching and signal integrity. It withstands isolation voltages up to 2.5 kVrms, ensuring protection between high-voltage and low-voltage sides.

The Si8663BB-B-IS1 is qualified to work across a wide operating temperature range from -40°C to 125°C, including compliance with automotive AEC-Q100 standards. It meets recognized global certifications such as UL, IEC, and CSA, making it suitable for demanding industrial and automotive environments.

Its package dimensions of 9.9 mm length, 3.9 mm width, and 1.25 mm depth with surface mount leads enable compact design integration on printed circuit boards.

The device provides a reliable isolation solution especially suitable for applications such as industrial automation, motor control, data acquisition systems, and other embedded electronics systems requiring high-performance digital signal isolation.

The device supports six digital channels for advanced signal isolation applications. It operates at a supply voltage of 5.5 V for efficient power-performance balance. The isolator offers a propagation delay time of 13 ns and a rise time of 4 ns.

It is suitable for operation in temperatures from -40°C to 125°C, meeting automotive AEC-Q100 standards. Low power dissipation of 415 mW ensures thermal efficiency. The device package dimensions are 9.9 mm length, 3.9 mm width, and 1.25 mm depth.

Designed for surface mount technology with 16 pins in SOIC style package. High noise immunity and reliable long lifecycle enabled by proprietary capacitive isolation technology. Conforms to UL, IEC, and CSA standards ensuring broad compliance.

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