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| Country of Origin | United States |
|---|---|
| Brand | TE Connectivity |
| Orientation | Vertical |
| Current | 1.5A |
| Mount Type | Board |
| Housing Material | Liquid Crystal Polymer |
| Contact Material | Phosphor Bronze |
| Series | 2102736 |
| Termination Type | Solder |
| Maximum Operating Temperature | 125°C |
| Minimum Operating Temperature | -55°C |
| Interfaces | Ethernet, Fibre Channel, InfiniBand applications, PCIe and Serial RapidIO high speed protocols |
| Number of Rows | 9 |
| Number of columns | 16 |
| Pitch | 1.8mm |
| Contact Plating | Gold Plated, Tin |
| Number of Contacts | 144 |
| Contact Gender | Female |
| Connector Gender | Female |
| Backplane Connector Type | High Speed |
TE Connectivity 2102736-1 is a high speed backplane connector designed for robust and reliable board-to-board connections in advanced electronic systems. Featuring a vertical female orientation with 144 contacts arranged across 16 columns and 9 rows, this connector facilitates high-density signal transmission.
The housing is engineered from liquid crystal polymer, offering resistance to mechanical stress and elevated temperatures up to 125°C. Contact material of phosphor bronze combined with gold-plated and tin plating ensures superior electrical performance and corrosion resistance. With a current rating of 1.5A, it supports demanding high-speed serial protocols including Ethernet, Fibre Channel, InfiniBand, PCIe, and Serial RapidIO.
This connector uses a modular ruggedized 'pinless' interface with quad-redundant contacts that increase resilience to shock and vibration, making it suitable for aerospace, defense, and commercial military applications such as missile defense and electronic C4ISR systems.
Mount type is board solder termination, facilitating secure connections on PCBs. Its compact 1.8 mm pitch allows integration into space-constrained designs requiring high-speed data transfer and signal integrity.
Features 144 contacts arranged in 16 columns and 9 rows. Supports a current rating of 1.5A for reliable signal integrity. Constructed with liquid crystal polymer housing for durability. Contacts are gold plated and made from phosphor bronze for excellent conductivity.
Designed for board mounting with solder termination. Operates from -55°C to 125°C ensuring wide temperature tolerance. Compatible with Ethernet, Fibre Channel, PCIe, and other high-speed protocols. Ruggedized design supports vibration and shock for aerospace and defense use.
Compact 1.8 mm pitch enables high-density circuit designs.
Applications include ground and missile defense, electronic systems, commercial and military aerospace, and other high reliability industrial environments. TE Connectivity’s MULTIGIG RT 2-R series offers the flexibility and modularity required for modern high-speed backplane interconnect designs.
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