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| Country of Origin | India |
|---|---|
| Voltage | 30V ac |
| Brand | TE Connectivity |
| Orientation | Straight |
| Current | 5A |
| Mount Type | Through Hole |
| Housing Material | Liquid Crystal Polymer |
| Contact Material | Phosphor Bronze |
| Series | Z-PACK |
| Termination Type | Solder |
| Maximum Operating Temperature | 125°C |
| Minimum Operating Temperature | -55°C |
| Number of Rows | 4 |
| Pitch | 2mm |
| Contact Plating | Gold over Nickel |
| Number of Contacts | 8 |
| Contact Gender | Male |
| Connector Gender | Male |
| Backplane Connector Type | Futurebus+ |
TE Connectivity 5536600-1 is a Z-PACK series 2 mm pitch Futurebus+ backplane connector designed for robust industrial and electronic applications. The connector features 8 contact points arranged in 4 rows with a straight male orientation, optimized for high density connections in backplane and rack systems.
Its housing is made of liquid crystal polymer, providing excellent mechanical strength and stability in demanding environments. The contact material is phosphor bronze with gold over nickel plating to ensure superior electrical conductivity and corrosion resistance.
This connector supports a current rating of 5 amps and a maximum voltage of 30 volts AC, making it suitable for signal and power applications. The through hole mounting and solder termination types facilitate secure PCB assembly with high reliability.
Operating effectively across a wide temperature range from -55°C to 125°C, this connector meets industry standards including Futurebus+ and IEC 1076-4-0X-(48B), ensuring compatibility and quality assurance.
Its modular and stackable design supports end-to-end system configurations, ideal for industrial, manufacturing, communications, and data center backplane interconnect solutions. Designed for high density and high speed signal and power connections.
Durable liquid crystal polymer housing material. Phosphor bronze contacts with gold over nickel plating for reliable conductivity. Rated for 5A current and 30V AC voltage operation. Through hole mount with solder termination for solid PCB bonding.
Wide operating temperature from -55°C to 125°C. Complies with Futurebus+ and IEC standards. Modular, stackable Z-PACK design for backplane applications.
This TE Connectivity backplane connector series is a trusted component in electronics manufacturing, telecommunications equipment, and industrial automation, enhancing connectivity reliability and performance. Browse our selection of connectors to find compatible parts and accessories.
Explore more products in our Backplane Connectors category.
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