TE Connectivity Z-PACK HM 2 mm Pitch Hard Metric Type A Backplane Connector, Straight Male, 22 Column, 7 Row, 154 5188834-1

TE Connectivity 5188834-1 is a Z-PACK HM series backplane connector featuring a 2 mm pitch and a Hard Metric Type A configuration. It provides a reliable connection solution with 154 contacts arranged in 22 columns and 7 rows, tailored for high-density applications requiring robust interconnectivity.

The connector offers a straight male orientation with housing manufactured from Polyethylene Terephthalate, delivering mechanical stability and durability. Contacts are made from phosphor bronze and plated with gold over nickel to ensure excellent conductivity and corrosion resistance. The press-in termination facilitates efficient and secure mounting, complemented by a through-hole mount type that guarantees a strong mechanical interface to the PCB.

This connector is engineered to meet the rigorous requirements of Compact PCI systems, supporting both 32-bit and 64-bit data transmission on 3U and 6U cards, making it suitable for industrial, telecommunications, computing, and data center applications. Its hot-swap capability benefits real-time systems by enabling online maintenance and system upgrades.

The Z-PACK HM system is a two-part interconnection solution facilitating secure and efficient mating between motherboards and daughterboards or backplanes, using advanced press-fit technology and Euro-style packaging that simplifies design implementation. This product ensures high performance, reliability, and a compact size for modern electronic systems.

Backplane connector with Hard Metric Type A design. Straight male orientation for reliable connection. Housing made of durable Polyethylene Terephthalate. Contact material is Phosphor Bronze with gold over nickel plating.

Press-in termination type for easy assembly. Mount type is through hole ensuring solid mechanical attachment. Part of the high-performance Z-PACK HM series with hot-swap capability. Ideal for Compact PCI and other backplane applications.

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