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Winbond SLC NAND 2 GB Parallel Flash Memory 48-Pin TSOP W29N02GVSIAA
Specifications
| Country of Origin | India |
|---|---|
| Brand | Winbond |
| Height | 1.05mm |
| Length | 12.1mm |
| Cell Type | SLC NAND |
| Model | W29N02GVSIAA |
| Width | 12mm |
| Mount Type | Surface |
| Series | W29N02GV |
| Maximum Operating Temperature | 85°C |
| Package Type | TSOP |
| Minimum Operating Temperature | -40°C |
| Memory size | 2GB |
| Interface Type | Parallel |
| Pin Count | 48 |
| Maximum Supply Voltage | 3.6V |
| Minimum Supply Voltage | 2.7V |
| Supply Current | 35mA |
| Organisation | 256M x 8 Bit |
| Number of Bits per Word | 8 |
| Maximum Random Access Time | 25μs |
| Number of Words | 256M |
| Bus Width | x8 |
| Random read | 25us |
| Page program time | 250us(typ.) |
| Block erase time | 2ms(typ.) |
Key Features
- This flash memory features a 2GB storage capacity for efficient data management.
- It uses Single Level Cell (SLC) NAND technology ensuring durability and endurance.
- The device operates with a supply voltage range from 2.7V to 3.6V, suitable for various industrial applications.
- It supports a parallel interface with 48 TSOP pins and x8 bus width for effective data communication.
- The chip has a maximum random access time of 25 microseconds for quick data retrieval.
- Operating temperature ranges from -40°C to 85°C, making it suitable for harsh environments.
- Page program time is typically 250 microseconds with a block erase time of 2 milliseconds.
- The device supports OTP memory area for secure data handling.
Product Description
Winbond W29N02GVSIAA is a 2Gb Single Level Cell (SLC) NAND Flash Memory featuring a parallel interface and a 48-pin Thin Small Outline Package (TSOP). It provides robust, reliable memory storage with a 256M x 8 bit organization. Operable over a voltage range of 2.7V to 3.6V, it supports industrial and commercial applications requiring resilient data access and retention.
This surface-mount device is designed for fast random read access with timings as low as 25 microseconds and typical page program time of 250 microseconds. The block erase time is typically 2 milliseconds, enhancing throughput in memory operations. Its ability to operate between -40°C and 85°C makes it suitable for demanding environments such as automotive electronics, industrial controls, and embedded systems.
The memory chip supports One-Time Programmable (OTP) memory areas to facilitate secure data storage, essential in various specialized applications.
The compact physical dimensions: 12.1 mm length, 12 mm width, and 1.05 mm height, accommodate efficient PCB design and integration in space-constrained electronic assemblies. This component does not hold any specific automotive standards but maintains high reliability in standard industrial use.
2GB memory size with SLC NAND technology for improved longevity and reliability. Parallel interface with bus width of x8 and 48-pin TSOP package ensuring compatibility and effective connectivity. Voltage supply range from 2.7V to 3.6V supports flexible electronic designs.
Operating temperature range from -40°C to 85°C ensures durability in extreme conditions. Quick access times: 25μs maximum random access and 250μs typical page program times. Block erase time of 2ms enhances memory management efficiency.
Supports OTP memory area for secure data storage applications. Compact dimensions enable space-efficient mounting on circuit boards.
This Winbond flash memory is widely applicable in industrial, automotive electronics, and embedded system designs requiring durable and fast memory solutions. Explore more in the Flash Memory category on EnvMart for similar semiconductor components and advanced memory technologies.
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Frequently Asked Questions
This model features a storage capacity of 2GB, utilizing Single Level Cell (SLC) NAND technology for efficient data management.
The device operates with a supply voltage range from 2.7V to 3.6V, making it suitable for various industrial applications.
It has a maximum random access time of 25 microseconds, allowing for quick data retrieval.
The chip has compact dimensions of 12.1 mm in length, 12 mm in width, and 1.05 mm in height, facilitating efficient PCB design.
It supports a parallel interface with a bus width of x8 and has 48 TSOP pins for effective data communication.
The typical page program time is 250 microseconds, enhancing the speed of memory operations.
The block erase time is typically 2 milliseconds, which contributes to efficient memory management.
It operates within a temperature range of -40°C to 85°C, making it suitable for harsh environments.
The memory is organized as 256M x 8 bits, providing a structured way to access the data stored.
Yes, it supports OTP memory areas for secure data handling, which is essential for various specialized applications.
This unit is designed for surface mounting, allowing for efficient integration into electronic assemblies.
The supply current for this device is 35mA, which is relevant for power management in electronic designs.
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