Isocom DC Input Optocoupler Surface Mount 4-Pin Tape & Reel TLP621SMT&R

The Isocom TLP621SMT&R is a DC input optocoupler incorporating an infrared LED and an NPN silicon phototransistor in a compact surface mount 4-pin package. It provides high electrical isolation and allows safe signal transmission between systems operating at different voltage potentials.

With a maximum forward voltage of 1.3V and a maximum input current of 50mA, this device is designed for efficient and reliable operation. It features fast switching typical rise and fall times of 2μs and 3μs, which are ideal for responsive industrial control and signal applications.

Operating over a wide temperature range from -30°C to 100°C, the TLP621SMT&R is suitable for diverse environmental conditions, including industrial machinery and instrumentation. Its high isolation voltage rating of 5300Vrms ensures noise immunity and signal integrity in demanding applications.

Supplied on tape and reel for compatibility with automated production lines, this optocoupler is well suited for high-volume manufacturing. Typical use cases include use in computer terminals, industrial system controllers, and measuring instruments where voltage isolation and signal integrity are critical.

This optocoupler features a surface mount 4-pin package designed for efficient PCB assembly. Maximum forward voltage rating is 1.3V ensuring low forward voltage drop. Input current type is DC, with maximum input current handling of 50mA.

Typical rise time of 2 microseconds and fall time of 3 microseconds support fast signal switching. Operating temperature extends from -30°C to +100°C for broad environmental tolerance. High isolation voltage of 5300Vrms provides excellent electrical isolation.

Current transfer ratio ranges between 50% minimum and 600% maximum for flexible signal coupling. Packaging provided as tape and reel ensures suitability for automated assembly.

Isocom’s TLP621SMT&R DC Input Optocoupler is ideal for use in industrial, electronic, construction, and manufacturing environments requiring robust isolation and compact form factor.

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