Takachi Electric Industrial 2 Surface Mount (SMT) Board FR4 Epoxy Glass Fabric Laminate 35 mm x 25 mm 1 mm Holes TNF25-35

Takachi Electric Industrial TNF25-35 is a high-quality 2 Surface Mount (SMT) board made from FR4 epoxy glass fabric laminate. Manufactured in Japan, this board measures 35 mm in length and 25 mm in width with a thickness of 1.6 mm, making it ideal for precise prototyping and SMT applications in industrial and laboratory environments.

The board features 9 by 13 holes each measuring 1 mm diameter arranged in a 2.54 mm pitch layout. This precise hole placement and sizing facilitate the mounting of various electronic components on both sides of the board, making it versatile for complex circuit designs.

Its robust FR4 material grade provides excellent mechanical strength and electrical insulation, suitable for demanding industrial electronics manufacturing processes and development tasks.

Designed for universal use, this surface mount board is perfectly sized to fit SW and SS series cases, enhancing its adaptability in multiple assembly setups. It is RoHS compliant, aligning with environmental safety requirements for hazardous substances.

This board features 9 by 13 holes sized at 1 mm for flexibility in circuit design. Board dimensions measure 35 mm length by 25 mm width providing a compact layout. Constructed using FR4 epoxy glass fabric laminate delivering durability and electrical insulation.

The thickness of the board is 1.6 mm, suitable for standard SMT applications. Designed for universal use with SW and SS series cases for mounting convenience. Compliant with RoHS standards ensuring environmental safety. Holes are arranged in a 2.54 mm pitch suitable for surface mount technology tasks.

Both sides of the board contain through holes allowing double-sided mounting applications. Manufactured in Japan ensuring high quality and manufacturing standards.

This prototyping board is ideal for industrial, electronic component development, manufacturing, and research laboratory applications. It facilitates efficient surface mount technology processes and electronic circuit prototyping with precision and reliability.

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