Malico High-Performance Aluminium BGA Chipset Heatsink, Clip Fastening, 12 mm Height, 42.5 mm Length & MBH42.5002-12P/2.6

Malico MBH42.5002-12P/2.6 BGA Chipset Heatsink is a high-performance cooling accessory manufactured from AL6063 grade aluminium offering thermal conductivity of 201 W/m K. Designed specifically for BGA chipsets, it utilizes a precision-forged clip attachment for secure fastening and efficient heat transfer.

The heatsink measures 42.5 mm in length and width with a height of 12 mm, finished in black anodised coating to enhance durability and thermal performance. It is suitable for cooling applications where natural convection or low to medium airflow levels are present, ensuring low pressure drop and efficient heat dissipation.

Available in wing-fin and pin-fin configurations, the heatsink offers high surface area to volume ratio for improved heat transfer in electronics heating and cooling systems.

This heatsink is ideal for use in industrial electronics cooling, HVAC systems, and electronic component thermal management where reliable and consistent temperature control is critical.

Constructed from high-quality aluminium with black anodised finish. Clip fastening mechanism for easy attachment to BGA chipsets. Optimized design for natural convection and moderate airflow cooling. Compact size suitable for dense electronic assemblies.

High thermal conductivity ensures effective heat dissipation. Explore the Malico range of Heatsinks on EnvMart for diverse application needs including electronics cooling, industrial thermal management, and HVAC systems.