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Malico Heatsink Clip for BGA Chipset 29mm Length × 29mm Width × 28mm Height Black Anodised Plastic Aluminium MBH29001-28W/2.6

Category Heatsink Brand Malico Condition New

Specifications

Country of Origin Taiwan
Brand Malico
Material Plastic, Aluminium 6063
Colour Black
Height 28mm
Length 29mm
Model MBH29001-28W/2.6
Finish Black Anodised
Width 29mm
For Use With Clip
Standards/Approvals UL 94 V0
Fastening Clip
Compatible Package Type BGA
Malico Heatsink, Clip 15 mm 29 mm 29mmBrand Malico

Key Features

  • Constructed with AL6063 grade aluminium plus plastic for effective heat dissipation.
  • Clip attachment ensures secure fastening and easy installation.
  • Offers high thermal conductivity of 201 W/m K for efficient cooling.
  • Ideal for natural convection and low to medium airflow applications.
  • Complies with UL 94 V0 standard ensuring safety and reliability.
  • Available in black anodised finish for durability and aesthetics.
  • Suitable for electronics heating and cooling components in industrial settings.
  • Made in Taiwan, Province of China, assuring manufacturing quality.

Product Description

Malico MBH29001-28W/2.6 is a precision-engineered heatsink clip specifically designed for BGA chipsets. With physical dimensions of 29mm length, 29mm width, and 28mm height, this heatsink provides reliable thermal management through its high-performance AL6063 grade aluminium construction featuring a thermal conductivity of 201 W/m K.

The heatsink is attached using a durable plastic clip, enabling easy installation and secure fastening to compatible chipsets. The product’s black anodised finish enhances corrosion resistance and mechanical robustness, making it suitable for a variety of industrial and commercial electronic applications.

Designed for excellent heat dissipation during natural convection or in conditions of low to medium airflow, the heatsink maintains low-pressure drop for optimized cooling efficiency. It meets the UL 94 V0 flammability standard, ensuring compliance with industry safety protocols.

This heatsink clip is ideal for cooling BGA chipsets used in electronics manufacturing, HVAC, automation, and laboratory instrumentation. Its thermally optimized wing-fin or pin-fin design provides a high surface area to volume ratio to maximize cooling performance.

Constructed with AL6063 grade aluminium and plastic clip for effective heat handling. High thermal conductivity at 201 W/m K ensures efficient temperature control. Clip fastening mechanism allows secure and convenient attachment.

Black anodised finish provides durable corrosion resistance. Complies with UL 94 V0 flammability standard for safety. Offers excellent performance under natural convection and moderate airflow. Suitable for use in electronics cooling, HVAC, and industrial automation systems.

Manufactured in Taiwan, Province of China, representing quality craftsmanship.

For professionals in electronics design, manufacturing, and thermal management, the Malico MBH29001-28W/2.6 heatsink clip represents a robust solution to thermal dissipation challenges, enhancing device reliability and performance.

Explore the full range of Heatsinks and thermal management components in our Electronics Components category to find matched accessories and complementary products.

Malico Heatsink Clip for BGA Chipset 29mm Length × 29mm Width × 28mm Height Black Anodised Plastic Aluminium MBH29001-28W/2.6
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Frequently Asked Questions

This model has dimensions of 29mm in length, 29mm in width, and 28mm in height.

It is constructed from AL6063 grade aluminium and plastic, providing effective heat dissipation.

The heatsink clip offers a high thermal conductivity of 201 W/m K for efficient cooling.

It features a clip fastening mechanism that ensures secure attachment and easy installation.

It complies with the UL 94 V0 flammability standard, ensuring safety and reliability.

The clip has a black anodised finish that enhances corrosion resistance and mechanical robustness.

It is suitable for cooling BGA chipsets in electronics manufacturing, HVAC, automation, and laboratory instrumentation.

The heatsink clip is manufactured in Taiwan, Province of China, assuring quality craftsmanship.

It is designed for effective performance under natural convection and low to medium airflow conditions.

The weight of this model is not specified in the provided data.

This model is optimized for natural convection and low to medium airflow applications, not specifically for high airflow.

It is compatible with BGA package types, making it suitable for specific chipsets.

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