Malico Heatsink Clip 28 mm x 25 mm x 25 mm Black Anodised MBH25001-28W/2.6

Malico MBH25001-28W/2.6 heatsink clip is a high-performance component designed for electronics cooling applications, specifically targeting BGA chipsets. This heatsink clip features precise dimensions of 28 mm height, 25 mm width, and 25 mm length, making it suitable for compact electronic assemblies where effective thermal management is critical.

The heatsink is manufactured using AL6063 grade aluminium, known for its excellent thermal conductivity at 201 W/m K, combined with a plastic clip for secure attachment. The black anodised finish not only adds a professional aesthetic but also improves corrosion resistance and durability under operational conditions.

It is compliant with the UL94-V0 flame retardant standard, ensuring enhanced safety in electrical and electronic applications where fire risk mitigation is paramount. The clip fastening mechanism simplifies installation and maintenance within assembly lines or repair settings.

This heatsink is optimized for both natural convection and low to medium airflow environments, achieving efficient heat dissipation without imposing significant pressure drops. The design, available in wing-fin and pin-fin types across the range, provides a high surface area to volume ratio, elevating thermal performance.

Constructed from plastic and aluminium with a black anodised finish. Dimensions: 28 mm height, 25 mm width, 25 mm length. Fastening via clip for secure and easy attachment. Thermal conductivity supported by AL6063 grade aluminium.

UL94-V0 flame retardant compliance enhances safety. Suitable for BGA chipset cooling applications. Performs well with natural convection and low to medium airflow. Manufactured in Taiwan, Province Of China.

Ideal for use in electronics manufacturing, industrial automation, HVAC systems, and maintenance environments where reliable thermal management is essential. Explore more Heatsink solutions and accessories in EnvMart's extensive Electronics Components category to meet various system design requirements and improve operational efficiency.