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| Country of Origin | Taiwan |
|---|---|
| Brand | Malico |
| Material | Plastic, Aluminium 6063 |
| Colour | Black |
| Height | 28mm |
| Length | 31mm |
| Model | MBH31001-28W/2.6 |
| Finish | Black Anodised, Anodised Natural |
| Width | 31mm |
| Series | MBA31001 |
| For Use With | Clip |
| Standards/Approvals | UL 94 V0 |
| Fastening | Clip |
| Compatible Package Type | BGA |
| Malico Heatsink, Clip 15 mm 31 mm 31mmBrand | Malico |
Malico MBH31001-28W/2.6 Heatsink Clip is a precision-engineered thermal management component designed specifically for Ball Grid Array (BGA) chipsets. Measuring 31 mm in length, 31 mm in width, and 28 mm in height, this heatsink clip combines plastic and aluminium 6063 materials to deliver efficient heat dissipation in electronic assemblies.
The heatsink utilizes AL6063 grade aluminium with an impressive thermal conductivity of 201 W/m K, enabling superior heat transfer. The black anodised finish not only enhances corrosion resistance but also improves thermal performance by increasing surface emissivity.
This component features a clip fastening mechanism, allowing secure and convenient attachment to BGA packages without additional hardware. Designed for high-performance electronics cooling, it maintains excellent thermal performance under natural convection as well as low to medium airflow conditions, with minimal pressure drop.
Malico MBH31001-28W/2.6 complies with UL 94 V0 flammability standards, ensuring safety in electrical and electronic applications. This product is manufactured in Taiwan, Province of China, reflecting stringent quality and manufacturing controls.
Constructed from plastic and aluminium 6063 for reliable durability and effective heat transfer. High thermal conductivity of AL6063 at 201 W/m K enables efficient heat dissipation. Black anodised finish provides corrosion resistance and improved thermal performance.
Clip attachment system simplifies installation on BGA chipsets. Suitable for natural convection and low to medium airflow cooling environments. UL 94 V0 compliant for enhanced safety in electronics applications. Precision-forged design offers high performance and reliability.
Manufactured in Taiwan to uphold quality standards.
This heatsink clip is ideal for industrial, electronics manufacturing, laboratory, and HVAC applications requiring reliable thermal management of BGA chipsets. Explore more in the Heatsinks category on EnvMart for complementary thermal components and accessories.
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