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| Country of Origin | Taiwan |
|---|---|
| Brand | Malico |
| Material | Cu1100 |
| Height | 33mm |
| Length | 37.5mm |
| Model | CMBA054949 |
| Finish | Antioxidant Treatment |
| Width | 37.5mm |
| Series | CMBA054949 |
| Thermal Resistance | 2.5°C/W |
| For Use With | North Bridge Chip Set |
| Standards/Approvals | Plastic (UL94-V0) |
| Fastening | Screw |
| Compatible Package Type | BGA |
Malico CMBA054949 heatsink is a high-performance thermal management component engineered for cooling North Bridge Chip Sets. It features a thermal resistance of 2.5°C/W, enabling efficient heat dissipation to maintain optimal chip performance and prevent overheating in electronic devices.
Constructed from high-purity copper (Cu1100), this heatsink is precision forged to maximize surface area, enhancing heat transfer. The base thickness of 2.6 mm ensures strong thermal conductivity, while the antioxidant treatment finish protects against corrosion and environmental degradation, extending the service life of the component.
The heatsink measures 33 mm in height, with a length and width of 37.5 mm each, making it suitable for compact mounting spaces on circuit boards. It is designed with screw fastening, spring, and pin fixings for reliable mechanical integrity and secure attachment through the board.
Compliance with Plastic (UL94-V0) standards assures flammability resistance, adding safety in electronic applications. The heatsink is compatible with BGA-type packages, which are common in modern chip assemblies.
Ideal for applications in electronics manufacturing, telecommunications, computing hardware, and industrial electronics, this heatsink plays a critical role in maintaining device reliability and performance by efficiently managing heat load.
Precision forged copper (Cu1100) for maximal thermal conduction. Antioxidant-treated surface to resist corrosion and wear. Compatible with BGA package type for chip heat dissipation. 33 mm height with 37.5 mm length and width dimensions.
Screw fastening and mounting pins for stable installation. Base thickness of 2.6 mm for enhanced heat transfer. Conforms to Plastic (UL94-V0) flammability standard. Manufactured in Taiwan, Province Of China, ensuring quality.
This heatsink is a dependable solution for thermal management in industrial electronics, computing, and telecommunication systems. Browse the EnvMart catalog for more heatsink options and electronics cooling components.
Explore more products in our Heatsinks category.
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