JST PUD Series Right Angle Through Hole PCB Header, 10 Contacts, 2 mm Pitch, 2 Row, Shrouded S10B-PUDSS-1(LF)(SN)

JST S10B-PUDSS-1(LF)(SN) PCB Header Connector is a right angle, through hole, shrouded PCB header with 10 contacts arranged in 2 rows at a 2 mm pitch, designed for wire-to-board connection applications. It offers reliable electrical performance and robust mechanical stability thanks to its copper alloy contact material with tin plating and a locking mechanism that ensures a secure mechanical fit with an audible click when mated. This connector handles currents up to 3A and voltages up to 250V, suitable for a broad range of electronics and industrial equipment including industrial control systems, consumer electronics, and communication devices.

The product features solder-type termination suited for through hole PCB mounting, providing strong mechanical and electrical connection. The operating temperature range of -25°C to 85°C enables use in diverse environmental conditions. Its compact and high-density two-row design assists in saving PCB space while maintaining reliable contacts, essential for modern, dense circuit designs. Manufactured in Japan, the product assures precision engineering and reliability.

The PUD series connectors are tailored for applications requiring stable contact performance under high vibration and mechanical stress, widely used in industrial automation, instrumentation, automotive systems, consumer electronics, and other demanding electronic assembly scenarios.

Stable contact performance for high vibration environments. Locking mechanism with audible click for secure mating. Copper alloy contacts plated with tin for reliable electrical connection. Wide operating temperature: -25°C to 85°C.

Rated current and voltage of 3A and 250V respectively. Solder termination type for through hole mounting. Compact 2-row, 10-contact right angle design at 2 mm pitch. Manufactured in Japan with high-quality standards.

This JST PCB header is an essential component for PCB connector applications requiring durability, reliable electrical performance, and compact form factor. It aligns with industrial standards and offers seamless integration into various electronics manufacturing and assembly processes.

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