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Intelligent LED Solutions Thermal Gap Pad 1.6 mm Thick 20 mm Diameter Metal Conductive ILH-X3535-PCB VER A
Specifications
| Country of Origin | China |
|---|---|
| Diameter | 20mm |
| Brand | Intelligent LED Solutions |
| THICKNESS | 1.6mm |
| Length | 20mm |
| Model | ILH-X3535-PCB VER A |
| Width | 20mm |
| Series | ILH-xxxx-PCB VER A |
| Maximum Operating Temperature | 155°C |
| Minimum Operating Temperature | -240°C |
| Trade Name | Thermal Adhesive Pads |
| Conductive Material | Metal |
| Cree | XHP35, XP-C, XP-E, XP-E2, XP-G, XP-G2, XP-G3, XP-L, XP-L2, XT-E |
| Nichia | NVSL119C, NVSW119C, NVSW219C, NVSL219C, NVSW119B-V1, NVSL119B-V1, NVSW219B-V1, NVSL219B-V1, NCSW119B-V1, NCSL119B-V1 and NCSW219B-V1 |
| LumiLED | Luxeon Q Seoul: Z5, Z5P, Z5M |
| Samsung | LH351D and LH351B LG: H35C4, H35F0, H35A0, H35B0 and H35C0 TSLC: N3535, C3535 |
Key Features
- This thermal gap pad enhances heat dissipation for LED modules in various industrial uses.
- It is non-self-adhesive and made from metal conductive material for reliable performance.
- Designed to operate within temperature ranges from -240°C to 155°C.
- Compatible with multiple LED families including Cree, Nichia, LumiLED, Samsung, LG, and TSLC.
- Supports LED designs requiring insulated metal substrates for improved thermal conductivity.
- Manufactured according to IEC and CE standards ensuring quality and safety compliance.
- Ideal for use in electronics heating and cooling components such as thermal pads.
Product Description
Intelligent LED Solutions ILH-X3535-PCB VER A thermal gap pad is engineered specifically for LED applications to optimize heat transfer and extend LED lifespan. The pad features a precise thickness of 1.6 mm and a diameter of 20 mm, constructed from high-quality metal conductive material to ensure efficient thermal conductivity in demanding industrial environments.
This thermal gap pad is designed for use with Insulated Metal Substrates (IMS), also known as Metal Clad Printed Circuit Boards. It enables improved thermal management by allowing more forward current to LEDs while maintaining die temperature stability, which translates into better lighting performance and the potential to reduce the number of LEDs required in an application.
The product complies with rigorous international standards such as IEC 61547, CE: EC 61374-2-13, IEC 62471:2006, EN 55015, ENEC 61374-2-13, IEC/EN 62384, and IEC 61000-3-2, affirming its reliability in electronic heating and cooling components.
Operating temperature ranges from a minimum of -240°C to a maximum of 155°C, supporting a wide range of industrial and laboratory thermal management scenarios. It is non-self-adhesive, allowing flexible application alongside heat sinks and other thermal interface materials.
Compatibility extends to renowned LED families such as Cree (XHP35, XP-C, XP-E series), Nichia (NVSL and NVSW series), LumiLED (Luxeon Q), Samsung (LH351D/B), LG, and TSLC series, making this pad highly versatile for LED assemblies.
This thermal gap pad significantly improves heat dissipation for LED electronic assemblies. It ensures thermal interface reliability in industrial, HVAC, manufacturing, and electronics contexts. Constructed to maintain integrity and performance under broad temperature extremes.
Enhances LED module efficiency and operating lifespan. Supports plug and play operations in LED thermal management setups.
Set your LED assemblies up for success with the Intelligent LED Solutions ILH-X3535-PCB VER A thermal gap pad. Explore more in Industrial Thermal Interface Sheets category on EnvMart for detailed specifications and related products.
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Frequently Asked Questions
The thermal gap pad has a thickness of 1.6 mm.
It can operate at a maximum temperature of 155°C.
The minimum operating temperature is -240°C.
The diameter of the pad is 20 mm.
It is compatible with multiple LED families including Cree, Nichia, LumiLED, Samsung, LG, and TSLC.
The pad is constructed from a metal conductive material.
No, it is non-self-adhesive, allowing for flexible application.
It complies with IEC 61547, CE: EC 61374-2-13, IEC 62471:2006, EN 55015, ENEC 61374-2-13, IEC/EN 62384, and IEC 61000-3-2.
It is designed for use in LED thermal management and electronic heating and cooling components.
The trade name for this product is Thermal Adhesive Pads.
It supports insulated metal substrates (IMS), also known as metal clad printed circuit boards.
The series name for this model is ILH-xxxx-PCB VER A.
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