Bergquist GP1500 Series Self-Adhesive Thermal Interface Sheet, 0.02in Thick, 1.5W/mK, 203.2mm x 101.6mm GP1500-0.020-02-0804

Bergquist GP1500 Series Self-Adhesive Thermal Interface Sheet, Model GP1500-0.020-02-0804, is engineered for controlling thermal transfer in electronics and industrial applications where reliable cooling and electrical isolation are critical. This pad is part of the advanced Gap Pad 1500 range, known for its excellent compliance and surface tack.

The GP1500-0.020-02-0804 pad features a thin 0.02in construction, allowing it to fit tight clearances and conform to irregular surfaces between heat-generating components and heat sinks or chassis. Its high thermal conductivity, rated at 1.5W/mK, speeds the transfer of heat away from sensitive PCB circuits, processors, and power electronics, mitigating overheating and improving component lifespan.

The sheet measures 203.2mm in length and 101.6mm in width, making it suitable for various board sizes, modules, and device enclosures. The unique gap pad material maintains Shore OO 40 hardness, providing both flexibility and resilience for vibration and movement, while the self-adhesive surface promotes simple, secure installation without additional fasteners or adhesives.

This pad is electrically isolating, ensuring no risk of short circuits between conductive surfaces, and is RoHS compliant - an essential specification for manufacturers and designers in regulated industries. With a density of 2.1g/cc and a Young's modulus of 45kPa, the pad is mechanically stable yet able to accommodate minor height differences between thermal interfaces.

Performance is maintained across challenging temperatures, from as low as -60°C up to 200°C, making it ideal for environments ranging from laboratory electronics, commercial HVAC units, and telecommunications racks to industrial control systems. Typical applications include CPU and GPU cooling, power supply heat management, PCB assembly thermal relief, server and networking hardware, and sensitive laboratory instrumentation.

The Gap Pad 1500’s unreinforced structure enhances compliancy, surface tack, and mounting flexibility, especially in high-density or miniaturized designs. The inherent surface tack of 2-across the pad ensures it holds firmly to surfaces during installation.

Industrial clients benefit from fast, precise installations, minimal material creep, and consistent performance in demanding cycles. This pad is suited for electronic assembly environments, field service for replacement and upgrades, and manufacturing lines requiring thermal management in compliance with international safety standards.

Browse other Bergquist thermal management solutions in the EnvMart Electronics Components category to meet diverse cooling and interface requirements in industrial and laboratory settings.