Samtec SEAF Series Straight Surface PCB Socket 150-Contact 10 Row 1.27 mm Pitch Solder SEAF-15-05.0-S-10-2-A-K-TR

Samtec SEAF-15-05.0-S-10-2-A-K-TR is a high-speed, high-density PCB socket designed for straight surface mounting in electronic assemblies. Featuring 150 contact points distributed across 10 rows, this PCB socket utilizes a 1.27 mm pitch with 2.5 mm row pitch, making it ideal for board-to-board connection systems requiring reliability and precision.

The housing is made from robust liquid crystal polymer, ensuring strong mechanical performance and resistance to high operating temperatures ranging from -55°C to 125°C. The contact material is copper alloy plated selectively with 0.000762 mm of gold in critical contact areas and matte tin on the tail section for optimal solderability and conductivity.

Designed to support a current of up to 2.7A and a voltage rating of 240V, this socket is well-suited for high-speed signal applications in industrial, commercial, and telecommunications sectors. The termination type is solder, and the socket has a stacking height of 18.5 mm, compatible with a variety of PCB layouts.

Additional features include alignment pins for secure mounting and polyimide film pick and place pads for effective automated assembly. The product comes in tape and reel packaging to facilitate high-volume manufacturing processes.

Constructed from liquid crystal polymer housing for high durability. Supports a maximum current of 2.7A and voltage up to 240V. Designed for surface mount with straight orientation enhancing ease of installation. Contacts are made of copper alloy with gold plating for superior conductivity and corrosion resistance.

Operates efficiently between -55°C to 125°C temperature range. Stacking height is 18.5 mm suitable for compact PCB designs. Includes lead free solder charge compliant with modern electronics standards. Available in tape and reel packaging facilitating automated assembly processes.

This Samtec SEAF series PCB Socket is extensively used in industrial control systems, telecommunications equipment, and advanced electronic devices requiring reliable board interconnects with high speed and high density. It is a critical component in electronic manufacturing for environments demanding consistent electrical performance under varying conditions.

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