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Molex Memory Card Connector Micro SIM 6 Contacts Surface Mount Gold Plated Copper Alloy 78646-3001

Category Memory Card Connector Brand Molex Condition New

Specifications

Country of Origin India
Brand Molex
Orientation Straight
Gender Female
Mount Type Surface
Housing Material Liquid Crystal Polymer
Contact Material Copper Alloy
Series 78646
Termination Type Push-in
Maximum Operating Temperature 85°C
Minimum Operating Temperature -30°C
Interfaces LAN cards
Number of Rows 1
Pitch 1.27mm
Contact Plating Gold over Nickel
Number of Contacts 6
Card Type Micro SIM
Insertion/Removal Method Push Pull

Key Features

  • Constructed with gold plating over nickel contacts for superior conductivity and corrosion resistance.
  • Rated for 1500 mating cycles ensuring long-term reliability.
  • Operates within a temperature range of -30°C to 85°C suitable for diverse environmental conditions.
  • Low profile height of 1.45 mm to conserve space on circuit boards.
  • Features a stainless-steel shell for enhanced mechanical strength and corrosion resistance.
  • Typical use cases include mobile phones, wireless LAN cards, and GSM/UMTS modems.

Product Description

Molex 78646-3001 is a high-reliability memory card connector designed for Micro SIM cards, incorporating 6 high-quality copper alloy contacts with gold plating over nickel to ensure excellent electrical performance. This surface mount device supports push-pull insertion and removal to facilitate easy hand operation without tools.

Its compact design, with a height of only 1.45 mm, makes it ideal for space-constrained applications. The connector endures 1,500 mating cycles, emphasizing its robustness for industrial and consumer electronics use.

Operating reliably in a wide temperature range from -30°C to +85°C, it suits demanding environments commonly found in mobile communication devices and networking equipment.

The housing is manufactured from liquid crystal polymer, combining resistance to heat and mechanical stress. The stainless-steel shell additionally protects against corrosion, increasing product longevity.

Common applications include integration into mobile phones, wireless LAN cards, GSM and UMTS modems, and similar electronic devices where secure Micro SIM connections are critical.

Gold over nickel plated copper alloy contacts ensure optimal electrical conductivity. Push-in termination method simplifies PCB assembly. Single row with a standard pitch of 1.27 mm facilitates compatibility with common PCB layouts.

Compact, straight orientation design minimizes PCB footprint. Certified for no specific standards but built to meet industry durability norms.

This connector's design supports reliable and efficient data storage and transfer in electronic devices used across industrial, telecommunication, and consumer electronics sectors. For more product options and related connectors, browse the Memory Card Connector category on EnvMart.

Molex Memory Card Connector Micro SIM 6 Contacts Surface Mount Gold Plated Copper Alloy 78646-3001
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Frequently Asked Questions

The maximum operating temperature of the Molex Memory Card Connector is 85°C.

This model features 6 contacts for reliable connections.

The housing is made from liquid crystal polymer, and the contacts are copper alloy with gold plating over nickel for enhanced conductivity.

It utilizes a push-pull insertion and removal method, allowing for easy hand operation without tools.

The height of this connector is 1.45 mm, making it suitable for space-constrained applications.

This connector is designed for Micro SIM cards.

The orientation of this connector is straight.

It is rated for 1,500 mating cycles, emphasizing its robustness for various applications.

The standard pitch of this connector is 1.27 mm, which facilitates compatibility with common PCB layouts.

Common applications include mobile phones, wireless LAN cards, and GSM/UMTS modems.

The minimum operating temperature is -30°C, allowing it to function in diverse environmental conditions.

This model uses a surface mount type, suitable for various electronic assemblies.

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