Molex SL Series Right Angle Surface PCB Header, 2 Contacts, 2.54 mm Pitch, 1 Row, Shrouded 1591-7020

Molex 1591-7020 SL Series Right Angle Surface PCB Header is a high-quality, 2-contact connector with a 2.54 mm pitch and a single row configuration. This shrouded male header is designed for wire-to-board applications with a surface mount footprint, offering compact and reliable connections.

The header features gold-plated brass contacts housed in high temperature thermoplastic, providing excellent electrical conductivity and durability under demanding conditions. Its right angle orientation supports efficient board layout by allowing connections perpendicular to the PCB surface.

This component is rated for 3 amperes current and 250 volts, making it suitable for a wide range of industrial, electronic manufacturing, and power connector usage scenarios. It performs reliably over a wide temperature range from -40°C to 105°C, ensuring robustness in harsh environments.

The shrouded design protects contacts from mechanical damage and inadvertent shorts, enhancing longevity and connection stability. The surface mount termination facilitates automated assembly processes increasing production efficiency.

Supports 3A current rating for stable electrical performance. Features 2.54 mm pitch spacing for compatibility with standard PCBs. Constructed with high temperature thermoplastic housing for durability. Right angle orientation enables compact PCB mounting.

Shrouded design enhances connector protection and alignment. Gold-plated brass contacts ensure superior conductivity and corrosion resistance. Surface mount technology (SMT) termination for efficient assembly. Operates reliably in temperatures from -40°C up to 105°C.

Rated for 250V voltage handling suitable for various electronic applications.

This PCB Header is ideal for industrial electronics, telecommunications, computing hardware, and manufacturing sectors requiring precise and durable wire-to-board connections. Molex's 1591-7020 ensures a dependable interface that supports streamlined assembly and device performance.

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