Microchip RN42XVP-I/RM Bluetooth Chip Class 2, Version 2.1 + EDR, 4 dBm Output Power RN42XVP-I/RM

Microchip RN42XVP-I/RM Bluetooth Chip is a Class 2 Bluetooth 2.1 + EDR module designed to provide a compact, low-power Bluetooth communication solution. It supports serial UART and USB data interfaces, making it easy to integrate into embedded system designs requiring wireless communication.

This module offers backwards compatibility with previous Bluetooth versions 2.0, 1.2, and 1.1, and features a robust embedded Bluetooth stack implementing profiles like SPP, HID, and DUN. The chip operates within the 2.402 GHz to 2.480 GHz frequency range over 79 channels, providing reliable communication within a range of up to approximately 10 meters.

With a maximum output power of +4 dBm and receiver sensitivity of -70 dBm, it ensures stable wireless performance in industrial, electronic component manufacturing, and communication applications. It consumes low power, with typical sleep current of 26 μA and transmit current of 30 mA, enhancing battery life in portable devices.

The module features a small form factor with dimensions of 29.9 mm width, 24.4 mm length, and 2.4 mm height, suitable for compact PCB designs. It includes castellated SMT pads for direct PCB mounting and offers USB (HCI only) and UART interfaces for flexible data communication with host devices.

Operating temperature range from -40°C to 85°C makes it suitable for harsh industrial environments. The module is compatible with Microchip microcontrollers including PIC16F, PIC18F, PIC24F/H, dsPIC33, and PIC32 families.

Fully qualified Bluetooth 2.1 + EDR Class 2 module supporting multiple profiles. Backwards compatible with Bluetooth 2.0, 1.2, and 1.1 standards. Low power consumption with efficient sleep and transmit currents. Small form factor designed for easy PCB mounting.

Supports USB (HCI only) and UART interfaces for flexible connectivity. Operates in the 2.402 GHz to 2.480 GHz frequency band with 79 channels. Robust embedded stack with GAP, SDP, RFCOMM, L2CAP, SPP, HID, and DUN profiles.

Wide operating temperature range suitable for industrial applications. Compatible with a broad range of Microchip microcontrollers.

This Bluetooth module is ideal for integration in electronic assemblies, industrial communication devices, embedded systems, and wireless data exchange applications. Explore more Bluetooth Modules by Microchip and similar communication ICs at EnvMart.