Seeit Surface Mount 1.27 mm Pitch Test & Burn-in Socket DIP to SOIC ADA-SO28-300

Seeit ADA-SO28-300 is a high-quality surface mount test and burn-in socket designed for converting DIP packages to SOIC with a standard 1.27 mm pitch. It supports reliable connections with a current rating of 1A, making it suitable for electronic component testing and burn-in processes in laboratories and manufacturing environments.

The socket features durable phosphor bronze contacts with tin plating to offer excellent electrical conductivity and corrosion resistance. Its housing is made from Polybutylene Terephthalate, providing mechanical strength and stability during repeated use.

This test socket joins DIP and SOIC connections efficiently and is part of Seeit's PLCC series offering a range of universal socket adaptors that cover various package types including SOP, QFN, SSOP, TQFP, and TSOP, facilitating flexible PCB and component testing.

Offers a 1.27 mm pitch suitable for precise surface mount applications. Utilizes phosphor bronze contact material with tin plating for superior performance. Current rated at 1A for dependable electrical testing. Housing constructed from Polybutylene Terephthalate for enhanced durability.

Adaptable for DIP28 and SOP18/28 type packages in test setups. Manufactured in France to meet stringent quality standards. Ideal for use in electronic component testing, burn-in cycles, and evaluation processes. Part of an extensive range of Seeit socket adapters supporting multiple package formats.

This product is suitable for Industrial Electronics, Electrical Engineering, Laboratory Testing, Manufacturing, and Quality Control processes where precision and reliability are critical. EnvMart offers a wide selection of IC Socket Adapters and test connectors for diverse component testing needs.