Seeit Surface Mount 1.27 mm Pitch Test & Burn-in Socket, DIP to SOIC ADA-SOIC16-150

Seeit ADA-SOIC16-150 is a surface mount Test & Burn-in Socket designed with a precise 1.27 mm pitch for DIP to SOIC package conversion. This adaptable socket facilitates reliable testing and burn-in processes by allowing electronic components in SOP8/14/16 packages to interface with DIP16 footprints seamlessly.

This socket has 16 contacts on both the DIP (Dual Inline Package) and SOIC (Small Outline Integrated Circuit) sides, delivering secure connections during testing and debugging. The contacts employ tin plating over phosphor bronze material to provide good electrical conductivity and resistance to corrosion.

The housing is constructed from polybutylene terephthalate, a robust and stable plastic that ensures mechanical protection and durability under thermal cycling often encountered in burn-in testing environments. It supports a current rating of 1 ampere, suitable for low power semiconductor devices.

Seeit’s ADA-SOIC16-150 socket is manufactured in France, reflecting high quality and manufacturing standards. It is compatible with surface mount PCB designs, allowing easy integration into test fixtures or evaluation boards.

Additional product variations in the Seeit adapter range include options for MLF/QFN and SSOP packages to DIP conversions, providing versatility for diverse IC package testing requirements in laboratory, manufacturing, and repair applications.

Designed for converting SOP8/14/16 packages to DIP16 format. Features 16 contacts on both DIP and SOIC sides for secure connections. Contact plating uses tin for corrosion resistance. Mount type is surface mount for PCB integration.

Contact material is phosphor bronze ensuring good conductivity. Housing made from durable polybutylene terephthalate material. Rated for 1 ampere current carrying capacity. Manufactured in France ensuring quality standards.

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