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Seeit Straight Surface Mount 1.27 mm Pitch IC Socket Adapter DIP to SSOP ADA-SSOP28

Category Electronic Components, Power & Connectors Brand Seeit Condition New

Specifications

Country of Origin France
Brand Seeit
Orientation Straight
Current 1A
Model ADA-SSOP28
Mount Type Surface
Housing Material Polybutylene Terephthalate
Contact Material Phosphor Bronze
Series PLCC
Pitch 1.27mm
Contact Plating Tin
Connection Gender A Male
Number of Contacts A 28
Connection Gender B Female
Connection A DIP
Connection B SSOP
ADA-SOIC16-150 SOP8/14/16 to DIP16 (454-6803)
ADA-QFN28 MLF28/QFN28 to DIP28 (919-5536)
ADA-SO28-300 SOP18/28 to DIP28 (509-6292)
ADA-PLCC32-32 PLCC32 to DIP28 / DIP32 (454-6819)
ADA-PLCC32 PLCC32 to DIP32 (919-5539)
ADA-TQFP32 TQFP32 to DIP32 (919-5532)
ADA-TSOP32-14 TSOP32 to DIP32 (509-6309)
ADA-TSOP32-20 TSOP32 to DIP32 (454-6831)
ADA-QFN44 MLF44/QFN44 to DIP44 (919-5545)
ADA-PLCC44 PLCC44 to DIP44 (454-6825)
ADA-TSOP48-20 TSOP32/40/48 to DIP48 (454-6847)

Key Features

  • Supports 28 contacts with male DIP and female SSOP connections.
  • 1.27 mm pitch ensures precise and secure IC socket connectivity.
  • Constructed with phosphor bronze contacts plated with tin for reliable electrical performance.
  • Housed in durable polybutylene terephthalate material for mechanical stability.
  • Designed for surface mount with a straight orientation, suitable for PCB applications.
  • Current rating of 1 Amp, compatible with PLCC series devices.
  • Manufactured in France, ensuring quality standards.
  • Ideal for use in electronics assembly, testing, prototyping, and repair applications.

Product Description

Seeit ADA-SSOP28 is a straight surface mount IC socket adapter designed to convert DIP (Dual In-line Package) to SSOP (Shrink Small Outline Package) with a 1.27 mm pitch. This adapter is engineered for 28-pin DIP to SSOP package conversion, facilitating seamless integration in electronic circuits.

The adapter features 28 male DIP contacts and 28 female SSOP contacts, constructed from phosphor bronze with tin plating, providing excellent electrical conductivity and corrosion resistance. The housing is made from polybutylene terephthalate, a robust thermoplastic that ensures mechanical strength and durability in surface mount PCB assemblies.

Rated to handle a current of 1 Amp, it aligns with the PLCC series standards and offers straight contact orientation for simplified surface mount applications. Manufactured in France, this adapter delivers high-quality performance and reliability for electronic manufacturing and prototyping environments.

This product is part of the Seeit DIP socket adapter family, which includes adapters for various package types like SOP, QFN, PLCC, TQFP, and TSOP, enhancing flexible usage for diverse IC packages. It is suitable for industrial electronics, laboratory instrumentation, assembly testing, and repair tasks requiring efficient IC socket conversion.

Supports 28-pin DIP to SSOP package conversion. Tin-plated phosphor bronze contacts for reliable connectivity. Surface mount with straight orientation for PCB integration. Housing made of durable polybutylene terephthalate thermoplastic.

1 Amp current rating compatible with PLCC series devices. Manufactured in France, assuring quality standard compliance. Part of a wide range of Seeit DIP socket adapters for multiple IC packages. Applications include electronics manufacturing, prototyping, and repair.

Discover the full range of Seeit IC socket adapters and accessories on EnvMart, tailored to meet diverse industrial electronics needs.

Explore more products in our Electronic Components, Power & Connectors category.

Seeit Straight Surface Mount 1.27 mm Pitch IC Socket Adapter DIP to SSOP ADA-SSOP28
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Frequently Asked Questions

The pitch of this IC socket adapter is 1.27 mm, ensuring precise and secure connectivity.

It supports 28 contacts, featuring male DIP and female SSOP connections.

This model has a current rating of 1 Amp, making it compatible with PLCC series devices.

The contacts are made from phosphor bronze and are plated with tin, while the housing is constructed from polybutylene terephthalate.

The orientation of this adapter is straight, designed for surface mount applications.

This product is manufactured in France, ensuring compliance with quality standards.

This adapter facilitates connections from DIP (Dual In-line Package) to SSOP (Shrink Small Outline Package).

It is suitable for electronics assembly, testing, prototyping, and repair applications.

The housing material is polybutylene terephthalate, which provides mechanical stability.

The DIP side has a male connection, while the SSOP side has a female connection.

This model is designed for surface mount installation on PCBs, ensuring straightforward integration into electronic circuits.

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