Microchip 3.6V WiFi Module IEEE 802.11 b/g/n, Bluetooth 5, SDIO SPI Interface ATWILC3000-MR110CA

Microchip ATWILC3000-MR110CA 3.6V WiFi Module is a highly integrated IEEE 802.11 b/g/n RF/Baseband/MAC controller combined with Bluetooth 5 Low Energy capabilities. It is designed for embedded applications requiring robust wireless connectivity with minimal resource consumption.

The module supports multiple security protocols including WPA, WEP, and WPA2, ensuring secure wireless communications. It operates on the 2.4GHz ISM band at 2472MHz frequency and provides output power of 17dBm, enabling strong signal range and reliability.

With dimensions of 22.4mm length, 14.7mm width, and a thin 2mm height profile, this module is suitable for compact embedded designs. It interfaces easily with Microchip AVR or SMART MCUs, SMART MPUs, and other processors using SDIO and SPI interfaces. The module supports single spatial stream 1x1 802.11n mode, delivering throughput up to 46 Mbps UDP and 28 Mbps TCP/IP for efficient data transmission.

The ATWILC3000-MR110CA includes integrated power amplifier and transmit/receive switch to optimize radio performance. Advanced PHY signal processing contributes to superior sensitivity and extended range. It supports Wi-Fi Direct and Soft-AP functionalities allowing flexible deployment modes in IoT, industrial automation, and consumer electronics applications.

The on-chip memory management engine reduces host CPU load, enhancing overall system performance. Operating temperature range from -40°C to 85°C ensures reliable operation in diverse environmental conditions.

This module supports WPA, WEP, and WPA2 security standards. It operates at 2472MHz frequency with 17dBm output power. Compact form factor: 22.4mm length x 14.7mm width x 2mm height. SDIO and SPI interfaces enable simple connectivity to Microchip and other processors.

Single stream 1x1 802.11n mode offers tested throughput of 46 Mbps UDP and 28 Mbps TCP/IP. Integrated PA and T/R switch improve range and sensitivity. Supports Wi-Fi Direct and Soft-AP for flexible wireless deployment. Bluetooth 5 Low Energy module included for dual wireless protocols.

Wide operating temperature from -40°C to 85°C suitable for industrial use. On-chip memory management engine reduces host load for efficient operation.

Ideal for industrial, IoT, communication systems, and embedded applications requiring reliable WiFi and Bluetooth connectivity. Explore the Microchip range of wireless modules on EnvMart for advanced networking solutions.

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