RS PRO 1.27 mm Pitch 68 Way Surface Mount Through Hole PLCC IC Socket 183-1582

RS PRO 183-1582 is a 68 Way Surface Mount Through Hole PLCC (Plastic Leaded Chip Carrier) IC Socket with a precise 1.27 mm pitch. This socket facilitates the secure mounting of plastic leaded chips onto through-hole printed circuit boards (PCBs) for industrial and commercial electronics applications.

The socket's design adheres to JEDEC MS 016 and MS 018 pin count standards, ensuring compatibility with a broad range of chip sizes and industry specifications. Constructed with phosphor bronze contacts, plated with tin over nickel, it guarantees excellent electrical conductivity and corrosion resistance. The materials used, including a high-temperature polybutylene terephthalate housing and PPS insulator, provide durability and performance under a temperature range from -55°C to 105°C.

This product supports a voltage rating of 100 VAC and a current rating of 1 A, sufficient for a variety of low-power electronic circuits. The open frame design enhances visual inspection of solder joints during assembly, while the no solder wicking design helps maintain solder integrity and reliability.

Its straight orientation and through-hole socket mount type allow for stable mechanical and electrical connection to PCBs using surface mount device assembly methods. The socket is engineered to provide high-contact retention force through a superior precision-stamped contact design, contributing to consistent performance in demanding industrial, laboratory, electronics manufacturing, and repair environments.

The RS PRO 183-1582 IC socket is ideal for electronics engineers and technicians requiring a dependable interface for PLCC chips in applications ranging from prototyping to mass production.

Complies with JEDEC industry standards ensuring compatibility and reliability. Durable phosphor bronze contacts plated with tin over nickel resist corrosion. Open frame structure allows easy solder joint inspection. Temperature rating from -55°C to 105°C suits high reliability environments.

Designed to prevent solder wicking, ensuring long-term solder joint quality. Suitable for surface mount through-hole PCB assembly. Voltage and current ratings suitable for a wide variety of electronic applications. High retention force contact design for consistent chip holding.

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