Bergquist SP800 Series Self-Adhesive Thermal Interface Sheet 0.127 mm Thick 1.6 W/mK 12 in x 12 in Fibreglass SP800

Bergquist SP800 Series Self-Adhesive Thermal Interface Sheet SP800 delivers a precisely engineered thermal interface solution with a thickness of 0.127 mm and 1.6 W/mK thermal conductivity, measuring 12 in by 12 in. This Fibreglass-based sheet is designed for efficient thermal management between power semiconductors and heat sinks, providing reliable and safe heat dissipation in low pressure mounting conditions.

The self-adhesive feature enhances ease of installation for electronics heating and cooling applications across industrial, laboratory, HVAC, and manufacturing sectors. Its gold coloration indicates high-quality material composition, compatible with sensitive electronics requiring temperature stability between -60°C minimum and 180°C maximum operating temperatures.

With a Shore A hardness rating of 91, the sheet balances flexibility and mechanical strength, ideal for repeated use in thermally critical assemblies. This product complies with RoHS standards, ensuring its suitability for environmentally conscious production environments.

Common applications include thermal pads for power electronics, thermal interface materials in electronic assemblies, and insulators in thermal management modules. Constructed with Fibreglass material ensuring durability and effective heat transfer.

Self-adhesive design enables secure placement between heat-emitting components and radiators. Gold colored sheet provides excellent thermal interface performance. Operates reliably between temperatures of -60°C and 180°C.

Offers Shore A 91 hardness ensuring stable mechanical properties. Complies with RoHS standards for environmental and safety requirements. Manufactured in the United States maintaining high quality standards.

Ensure optimal thermal management by selecting Bergquist SP800 for electronic cooling needs. Explore our range of thermal interface materials and solutions at EnvMart for efficient industrial and laboratory thermal management components.