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nVent SCHROFF Extender Board Adapter Eurocard Test Adapter, Epoxy Glass Laminate, Compatible with PC / VME Bus 23021-657
Specifications
| Country of Origin | Germany |
|---|---|
| Brand | nVent SCHROFF |
| nVent SCHROFF 23021-613 Extender Board AdapterBrand | nVent SCHROFF |
Key Features
- Manufactured from epoxy glass-reinforced laminate EP-GC02 to DIN 40802 (FR4) standards.
- Compatible with cards up to 3 HE in height (100 mm).
- Features 1.6 mm thick PCB with 305 g/m² copper and gold-plated edge connector fingers.
- Pre-drilled 1.0 mm diameter holes on a 2.54 mm matrix for easy prototyping.
- Incorporates colander ground plane for maximum screening and glitch-free high-speed operation.
- Complete solder mask protection ensures durability in demanding environments.
- Designed for professional industrial and laboratory prototyping applications.
Product Description
nVent SCHROFF 23021-657 Extender Board Adapter is a precision Eurocard test adapter engineered for high-performance prototyping with PC and VME bus boards. It is constructed from high-quality epoxy glass-reinforced laminate EP-GC02, compliant with DIN 40802 (FR4) standards, ensuring excellent electrical insulation and mechanical stability.
The adapter supports cards up to 3 HE in height (100 mm), providing compatibility with a range of industrial and laboratory prototyping applications. The printed circuit boards feature a thickness of 1.6 mm with 305 g/m² (1 oz/ft²) copper laminated to the substrate for superior conductivity. The edge connector fingers are gold plated to 1.5 microns, enhancing durability and reliable electrical contact.
Pre-drilled 1.0 mm diameter holes arranged on a 2.54 mm (0.1 inch) matrix facilitate rapid prototyping and assembly. The component side includes a specialized colander ground plane designed for maximum electromagnetic screening and ensuring glitch-free high-speed operation, critical for sensitive electronic testing and development.
Complete solder mask protection safeguards the adapter against environmental factors and physical damage, extending the product lifespan in demanding industrial, laboratory, construction, and manufacturing environments. The robust design ensures reliable performance for electronics engineers and technicians.
Manufactured from epoxy glass-reinforced laminate EP-GC02 in accordance with DIN 40802 (FR4). Supports cards up to 3 HE (100 mm) in height for versatile application. PCB thickness of 1.6 mm with 305 g/m² copper and gold-plated edge connector fingers.
Pre-drilled holes of 1.0 mm diameter on a 2.54 mm matrix for efficient prototyping. Incorporates ground plane for enhanced screening and glitch-free operation. Solder mask protection enhances durability and longevity. Ideal for professional electronic prototyping and development workflows.
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Frequently Asked Questions
It is manufactured from epoxy glass-reinforced laminate EP-GC02, compliant with DIN 40802 (FR4) standards.
This unit supports cards up to 3 HE in height, which is 100 mm.
The PCB thickness is 1.6 mm.
It features 305 g/m² (1 oz/ft²) copper laminated to the substrate for superior conductivity.
The pre-drilled holes are 1.0 mm in diameter and arranged on a 2.54 mm matrix for efficient prototyping.
It incorporates a specialized colander ground plane designed for maximum electromagnetic screening and glitch-free high-speed operation.
It is manufactured in Germany.
It is designed for professional industrial and laboratory prototyping applications.
The robust design and solder mask protection enhance its durability and longevity in demanding industrial and laboratory settings.
The weight specification is not provided in the available data.
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