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TE Connectivity QSFP-DD Pluggable I/O Connector Female Press Fit 2 Port 1-Position 2342935-3
Specifications
| Country of Origin | India |
|---|---|
| Brand | TE Connectivity |
| Orientation | Right Angle |
| Current | 500mA |
| Housing Material | Stainless Steel |
| Contact Material | Copper Alloy |
| Series | QSFP-DD |
| Number Of Ports | 2 |
| Termination Type | Press Fit |
| Sub Type | Connector |
| Form Factor | QSFP |
| Standards/Approvals | RoHS |
| Contact Plating | Nickel Plated Copper Alloy |
| Number of Contacts | 1 |
| Contact Gender | Female |
| Connector Gender | Female |
Key Features
- Designed for QSFP-DD form factor enhancing data center density.
- Supports speeds up to 400 Gbps for advanced network applications.
- Compatible with 28G NRZ and 56G PAM-4 protocols.
- Nickel plated copper alloy contacts ensure reliable connectivity.
- Stainless steel housing offers durability and corrosion resistance.
- Features right angle orientation for compact PCB mounting.
- Meets RoHS standards for environmental compliance.
- Compact design suitable for servers, switches, and storage devices.
Product Description
TE Connectivity 2342935-3 QSFP-DD Pluggable I/O Connector is a female press fit connector featuring 2 ports and 1 position, designed to support cutting-edge data transmission up to 400 Gbps. Utilizing the QSFP-DD form factor, this connector addresses next-generation data center needs by increasing density while maintaining backward compatibility with existing QSFP solutions. It supports both 28G NRZ and 56G PAM-4 protocols, with a development path towards 112G PAM-4 for future upgrades.
The connector is equipped with nickel plated copper alloy contacts and housed in a robust stainless steel enclosure that offers excellent durability and corrosion resistance, suitable for demanding industrial environments. Its right angle design enables efficient PCB layout in constrained spaces.
TE Connectivity's proprietary heat sink technology allows the connector to operate cost-effectively within 15-18W applications, supporting thermal management critical to high-speed networking.
Applications include servers, switches, routers, storage devices, hyperscale data centers, and high performance computing systems. This connector is an essential component for modern network architectures requiring high density and speed performance.
Designed for QSFP-DD form factor enhancing data center density. Supports speeds up to 400 Gbps for advanced network applications. Compatible with 28G NRZ and 56G PAM-4 protocols. Nickel plated copper alloy contacts ensure reliable connectivity.
Stainless steel housing offers durability and corrosion resistance. Features right angle orientation for compact PCB mounting. Meets RoHS standards for environmental compliance. Compact design suitable for servers, switches, and storage devices.
Supports efficient heat dissipation with proprietary heat sink technology. Ideal for hyperscale data centers and high-performance computing. Explore more TE Connectivity products for reliable electronics and high performance connectivity solutions on EnvMart.
Explore more products in our Pluggable I/O Connectors category.
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Frequently Asked Questions
This connector supports data transmission speeds up to 400 Gbps, suitable for advanced network applications.
It is compatible with 28G NRZ and 56G PAM-4 protocols, with a development path towards 112G PAM-4 for future upgrades.
The connector features a right angle orientation, which is designed for compact PCB mounting.
The housing is made of stainless steel, while the contacts are nickel plated copper alloy, ensuring reliable connectivity and corrosion resistance.
This model features 2 ports and 1 position, designed for efficient connectivity in data center applications.
The connector has a current rating of 500mA, suitable for various applications.
Yes, it meets RoHS standards for environmental compliance.
It utilizes a press fit termination type, which is designed for reliable mounting on PCBs.
This connector is suitable for use in servers, switches, routers, storage devices, hyperscale data centers, and high-performance computing systems.
The connector is manufactured in India.
It features proprietary heat sink technology that allows it to operate effectively within 15-18W applications, facilitating efficient heat dissipation.
The connector is designed in the QSFP-DD form factor, enhancing data center density and maintaining backward compatibility with existing QSFP solutions.
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