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| Country of Origin | India |
|---|---|
| Brand | Microchip |
| Height | 1.25mm |
| Length | 4.9mm |
| Cell Type | Split Gate |
| Model | SST26WF080B-104I/SN |
| Width | 4mm |
| Mount Type | Surface |
| Series | SST26WF080B |
| Maximum Operating Temperature | 85°C |
| Package Type | SOIC |
| Minimum Operating Temperature | -40°C |
| Memory size | 8MB |
| Interface Type | SPI |
| Burst Modes | Continuous Linear Burst, 8/16/32/64 Byte Linear Burst with Wrap-Around |
| Pin Count | 8 |
| Maximum Supply Voltage | 1.95V |
| Minimum Supply Voltage | 1.65V |
| Maximum Clock Frequency | 104MHz |
| Organisation | 1M x 8 Bit |
| Number of Bits per Word | 8 |
| Maximum Random Access Time | 3ns |
| Number of Words | 1M |
| Page-Program | 256 Bytes per page in x1 or x4 mode |
Microchip SST26WF080B-104I/SN is a Split Gate 8 MB SPI Flash Memory device housed in an 8-pin SOIC package. Operating at a supply voltage range of 1.65 to 1.95 volts and supporting a maximum clock frequency of 104 MHz, this memory component enables high-speed serial peripheral interface (SPI) communication. This device employs split gate cell technology, providing efficient and reliable data storage for embedded and industrial applications.
Designed to operate reliably in harsh environments, it supports an industrial temperature range from -40°C up to 85°C, making it suitable for diverse industrial, automotive, and consumer electronics applications. The flash memory offers low power consumption characteristics, with active read current typically at 15 mA and standby current as low as 10 µA, thus extending battery life in portable systems.
The SST26WF080B/040B/016B family features Serial Quad I/O (SQI) protocol compatibility, enabling minimum latency execute-in-place (XIP) operations without the need for SRAM code shadowing. Additional features include flexible burst modes with continuous linear bursts and wrap-around capabilities for enhanced data throughput. The page-program feature allows programming of 256 bytes per page in x1 or x4 mode, enabling efficient memory updates.
Its robust design includes fast erase times, with sector/block erase typically at 18 milliseconds and chip erase at 35 milliseconds, facilitating rapid memory management. The device supports software reset, write-suspend operations, and software protection features to safeguard data integrity in various use cases.
Typical use cases for this flash memory include industrial automation, embedded systems, automotive electronics, consumer devices, and other applications requiring reliable non-volatile storage with high-speed access. The surface mount SOIC package ensures easy integration into compact PCB layouts for modern electronics.
Discover more about Microchip's advanced flash memory solutions to enhance your electronic component designs and improve system performance. Offers 8 MB memory size with SPI serial interface. Packaged in an 8-pin SOIC surface mount package.
Supports maximum clock frequency up to 104 MHz for fast data access. Operates at a supply voltage range from 1.65V to 1.95V. Features split gate cell architecture for reliable flash memory operation. Designed for industrial temperature range from -40°C to 85°C.
Includes advanced burst modes with linear burst and wrap-around options. Supports page-program of 256 bytes per page in x1 or x4 mode. Low power consumption: typical active read current is 15 mA at 104 MHz. Uses surface mount technology suitable for compact PCB designs.
Explore our selection of Flash Memory components at EnvMart for high-performance semiconductor solutions.
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